Immersion Cooling Flow Channels Using Segmented Partitions
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Solution Overview
Problem
Existing fluid immersion cooling systems for electronic apparatuses suffer from poor cooling efficiency due to inefficient flow channels and interactions between cooling liquid and vaporized bubbles.
Innovation Solution
A fluid immersion cooling system with a housing, circuit boards, and partitions, where the circuit boards have guide holes and the partitions reduce the space between circuit boards, creating a continuously bent flow channel for the cooling liquid. This design aligns the flow direction of the cooling liquid with the bubbles, enhancing flow speed and pressure difference, thus improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the cooling liquid flows directly through the accommodating cavity without partitions, then the flow channel is simple and device complexity is low, but the flow speed is insufficient and cooling efficiency is poor
Solution Approach 1:
The accommodating cavity is segmented into multiple flow channels by introducing partitions, which divide the cooling liquid flow into multiple paths. This increases the flow speed and cooling efficiency without requiring a complete redesign of the entire system, thus improving productivity while controlling device complexity.
Solution Approach 2:
The partitions are arranged at different heights and positions to create a three-dimensional bent flow channel structure. This transforms the simple linear flow path into a multi-dimensional path that increases flow velocity and heat exchange efficiency, improving cooling efficiency without excessive structural complexity.
2Productivity
If partitions are introduced to create bent flow channels, then the flow speed of cooling liquid increases and cooling efficiency improves, but the device complexity increases
Solution Approach 1:
The cooling system is segmented into multiple flow channels using partitions, allowing the cooling liquid to flow through distinct paths. This segmentation increases flow velocity and heat exchange efficiency, improving cooling efficiency while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The flow channel is designed as a continuously bent path rather than straight lines, using curved transitions between segments. This curvature design improves flow dynamics and cooling efficiency while avoiding sharp angles that would increase structural complexity and manufacturing difficulty.
3Productivity
If the flow channel is made continuously bent with partitions, then the flow direction aligns with bubbles and pressure difference increases, but the manufacturing precision requirements increase
Solution Approach 1:
The continuously bent flow channel uses smooth curved transitions instead of sharp angles, which aligns the flow direction with bubble movement and increases pressure difference for improved cooling efficiency. The curved geometry is more tolerant to manufacturing variations compared to sharp corners, reducing the impact on manufacturing precision requirements.
Solution Approach 2:
The flow channel geometry parameters (curvature radius, bend angles, partition positions) are optimized to achieve the desired flow characteristics and pressure difference while remaining within manufacturable ranges. This allows improved cooling efficiency without excessively stringent manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves enhanced cooling efficiency by increasing the flow speed of both the cooling liquid and bubbles, reducing collisions, and improving the critical heat flux density, effectively addressing the limitations of existing systems.
Implementation Method 1
The cooling liquid is configured for cooling the circuit board and performing convection heat exchange with the circuit board, and a part of the cooling liquid is vaporized during this process
Implementation Method 2
a part of the cooling liquid is vaporized during this process
Data Source
AI summary
The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.