Server Rack Heat Sink Liquid Cooling Auxiliary Dissipation
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Solution Overview
Problem
Current server heat dissipation systems face challenges in efficiently managing high heat density in data centers, leading to local overheating and high energy consumption, particularly due to limitations in air cooling efficiency and the need for costly and complex liquid cooling system installations.
Innovation Solution
A server heat dissipation system combining a liquid cooling device with an auxiliary heat dissipation device, where the liquid cooling device directly cools server chips using a primary heat transfer medium and the auxiliary device handles remaining heat through air flow, eliminating the need for cabinet reconstruction and utilizing natural-cooling techniques for energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling device is used to cool server chips, then cooling efficiency is improved, but device complexity and installation cost increase
Solution Approach 1:
The cooling system is divided into independent functional modules: liquid cooling device for high-heat chips, auxiliary heat dissipation device for remaining heat, and natural cooling system for ambient temperature regulation. Each module operates independently and can be selectively activated based on thermal requirements.
Solution Approach 2:
A heat transfer medium (liquid coolant) serves as an intermediary between the server chips and the cooling system, efficiently carrying heat away from chips without requiring direct contact between cooling components and server hardware, thus simplifying installation.
2Temperature
If liquid cooling system is installed in existing cabinets, then cooling performance improves, but cabinet reconstruction is required
Solution Approach 1:
The cooling system is designed as a standalone external unit that can be attached to existing server cabinets without modifying the cabinet structure. The liquid cooling device connects to server chips through external interfaces, preserving the original cabinet while adding cooling capability.
Solution Approach 2:
The auxiliary heat dissipation device serves multiple functions: it dissipates remaining heat from servers, provides natural cooling when ambient conditions permit, and can operate independently or in conjunction with the liquid cooling system, making the overall solution adaptable to various installation scenarios.
3Temperature
If air cooling is used for remaining heat, then energy consumption increases, but local overheating is prevented
Solution Approach 1:
The system dynamically switches between cooling modes based on thermal conditions: liquid cooling activates when chips exceed temperature thresholds, auxiliary heat dissipation handles moderate heat loads, and natural cooling operates when ambient conditions are favorable. This dynamic activation minimizes energy consumption while preventing overheating.
Solution Approach 2:
The auxiliary heat dissipation device utilizes natural convection and ambient air flow to dissipate heat without requiring high-energy forced air circulation. The system leverages existing environmental conditions (ambient temperature, air flow patterns) to provide passive cooling, reducing overall energy requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides high cooling efficiency without local overheating, reduces energy consumption, and allows for widespread adoption of liquid cooling technology without the need for custom cabinet designs, offering a cost-effective and energy-efficient data room operation.
Implementation Method 1
a liquid cooling device to perform direct liquid cooling to the liquid cooled servers... a liquid heat dissipater provided for performing heat dissipation to server chips
Implementation Method 2
a primary heat transfer medium, which flows into the liquid heat dissipater through the distributor and the liquid inlet pipes, and then flows out from the liquid heat dissipater through the liquid outlet pipes
Implementation Method 3
an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooled servers
Implementation Method 4
the auxiliary device handles remaining heat through air flow
Data Source
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AI summary
A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.