Variable Diodicity Fluid Diodes for Two-Phase Flow Control

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Solution Overview

Problem

Microchannel two-phase cooling systems experience fluid backflow due to boiling instabilities, which deteriorates cooling performance in heat-generating devices like power electronics.

Innovation Solution

Incorporating a fluid diode array with varying diodicities at the channel inlets of heat sink fluid channels to preferentially direct the cooling fluid flow forward and prevent backflow, with higher diodicity fluid diodes positioned near the center of the cooling manifold where boiling instabilities are most pronounced.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If two-phase cooling is used to increase heat transfer capacity, then heat transfer efficiency is improved, but fluid backflow occurs due to boiling instabilities

Engineering Contradiction:
Improveheat transfer capacityVSAvoidflow stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

Fluid diodes are introduced as intermediary components between the heat source and heat sink channels. These diodes act as mediators that permit forward flow while blocking backflow caused by boiling instabilities, thus resolving the contradiction between maintaining high heat transfer capacity and ensuring flow stability in two-phase cooling systems

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

Fluid diodes with varying diodicity values are strategically positioned at different locations within the cooling manifold. The diodicity of each fluid diode is tailored to the local boiling characteristics and heat flux conditions at its specific position, creating locally optimized flow control that maintains system-wide stability while preserving overall heat transfer efficiency

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If uniform fluid diodes are used throughout the cooling manifold, then manufacturing is simplified, but flow distribution becomes suboptimal due to varying local conditions

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcooling efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent implements fluid diodes with non-uniform diodicity values distributed throughout the cooling manifold. Each fluid diode's diodicity is specifically selected to match the local thermal and hydraulic conditions at its position, such as local heat flux, boiling intensity, and channel geometry. This local optimization ensures that each diode provides appropriate flow control for its specific location, maximizing overall cooling efficiency while the modular diode design keeps manufacturing feasible through standardized components with varying geometric parameters

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The fluid diode array effectively restricts backflow, enhancing the cooling performance and efficiency of the microchannel two-phase cooling system by ensuring consistent heat transfer from heat-generating devices.

Implementation Method 1

Cooling fluid may be used to receive heat generated by the heat-generating device by convective thermal transfer, and remove such heat from the heat-generating device

Methodology Applied
Scientific EffectConvective thermal transfer: Convection

Implementation Method 2

the cooling fluid is allowed to boil such that heat may be stored in the latent heat of the cooling fluid

Methodology Applied
Scientific EffectBoiling: Boiling

Implementation Method 3

heat may be stored in the latent heat of the cooling fluid

Methodology Applied
Scientific EffectLatent heat: Latent Heat

Implementation Method 4

Two-phase cooling devices use a cooling fluid at or near saturation such that, as heat is removed from the heat-generating device, the cooling fluid is allowed to boil

Methodology Applied
Scientific EffectTwo-phase flow control: Two-Phase Flow

Data Source

PatentUS10945354B1Cooling systems comprising fluid diodes with variable diodicity for two-phase flow control
Publication Date: 2021.03.09 TOYOTA JIDOSHA KK
  • US10945354B1 patent drawing
  • US10945354B1 patent drawing
  • US10945354B1 patent drawing

AI summary

A microchannel two-phase cooling apparatus includes a cooling manifold and a fluid diode array. The cooling manifold includes one or more fluid inlets, one or more fluid outlets, and a plurality of fluid channels extending between and fluidly coupling the one or more fluid inlets and the one or more fluid outlets. The fluid diode array includes a plurality of fluid diodes positioned within the cooling manifold. Individual fluid diodes of the fluid diode array are fluidly coupled to individual fluid channels. The fluid diode array includes a first set of fluid diodes having a first average diodicity and a second set of fluid diodes having a second average diodicity. The first average diodicity is greater than the second average diodicity and each individual fluid diode of the first set of fluid diodes has a greater diodicity than any individual fluid diode of the second set of fluid diodes.