Dual Leadframe Stacked Structure for Semiconductor Height Reduction
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Solution Overview
Problem
Current semiconductor technologies face challenges in shrinking board outlines and weight while maintaining thermal dissipation and signal routing capabilities, as leadframes become fragile when trying to achieve higher density and power handling.
Innovation Solution
A dual leadframe system is introduced, where one leadframe is dedicated to signal routing and the other to power distribution and heat dissipation, with joints linking the two, allowing for half-etched portions to embed semiconductor chips and components, reducing system height and enhancing robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If leadframe density is increased to route more signals, then signal routing capability is improved, but leadframe robustness deteriorates
Solution Approach 1:
The leadframe is divided into two separate half-etched leadframes (first and second leadframes) that are stacked and linked together. This segmentation allows each leadframe to be optimized for specific functions (signal routing in one, power/heat in the other) while maintaining adequate thickness and robustness in both, resolving the contradiction between high density and structural strength.
2Area of stationary object
If board area is reduced to shrink product outline, then product size is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The solution transitions from a two-dimensional planar layout to a three-dimensional stacked configuration. By stacking two half-etched leadframes vertically and linking them, the system achieves enhanced thermal dissipation pathways through the stacked structure while maintaining a reduced horizontal board footprint, thus resolving the contradiction between compact size and thermal management.
3Productivity
If leadframe thickness is reduced to enable finer lines, then signal routing density is improved, but mechanical strength deteriorates
Solution Approach 1:
Instead of using a single thin leadframe, the system employs two half-etched leadframes with moderate thickness that are stacked together. Each leadframe maintains sufficient thickness for mechanical strength, while the combined stacked structure achieves the required signal routing density and functionality, resolving the contradiction between thinness for density and thickness for strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces system height, enhances reliability, and lowers costs by eliminating the need for clips and wires, while maintaining electrical and thermal performance.
Implementation Method 1
metal protrusions suitable for deformation under pressure
Data Source
AI summary
A dual leadframe (100) for semiconductor systems comprising a first leadframe (110) having first metal zones separated by first gaps, the first zones including portions of reduced thickness and joint provisions in selected first locations, and further a second leadframe (120) having second metal zones separated by second gaps, the second zones including portions of reduced thickness and joint provisions (150) in selected second locations matching the first locations. The second leadframe is stacked on top of the first leadframe and the joint provisions of the matching second and first locations linked together. The resulting dual leadframe may further include insulating material (140) filling the first and second gaps and the zone portions of reduced thickness, and has insulating surfaces coplanar with the top and bottom metallic surfaces.