Dual-Material Fin Structure for Cooling Without Copper Weight

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Solution Overview

Problem

Conventional fin assemblies made of single materials face challenges in achieving high thermal conductivity, low cost, and light weight, with aluminum assemblies being ineffective for cooling and copper assemblies increasing manufacturing costs and weight.

Innovation Solution

A fin structure composed of two assemblies made of different materials, where the inlet fin assembly has higher thermal conductivity than the outlet fin assembly, allowing rapid heat transfer and efficient cooling, while the outlet fin assembly is made of a lower thermal conductivity material for cost-effectiveness and reduced weight.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the fin assembly is made of copper with higher thermal conductivity, then the cooling efficiency is improved, but the manufacturing cost and weight are increased

Engineering Contradiction:
Improvecooling efficiencyVSAvoidweight of fin assembly
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The fin assembly is divided into two regions with different material properties: the inlet fin assembly uses high thermal conductivity material (copper) for effective heat absorption, while the outlet fin assembly uses low thermal conductivity material (aluminum alloy) for weight reduction and cost savings. This local differentiation resolves the contradiction by applying high-performance material only where most needed.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The fin assembly combines two different materials (copper and aluminum alloy) in a composite structure. The inlet portion uses copper for superior thermal conductivity to maximize heat transfer from the heat source, while the outlet portion uses aluminum alloy to reduce overall weight and cost, achieving a balance between cooling efficiency and weight.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the fin assembly is made of copper with higher thermal conductivity, then the cooling efficiency is improved, but the manufacturing cost is increased

Engineering Contradiction:
Improvecooling efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

High-cost copper material is applied only to the inlet fin assembly where heat transfer efficiency is most critical, while the outlet fin assembly uses lower-cost aluminum alloy. This localized material selection reduces overall manufacturing cost while maintaining adequate cooling performance.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The composite structure combines expensive copper and inexpensive aluminum alloy in a cost-optimized configuration. The copper inlet fins provide necessary thermal performance at the heat source interface, while aluminum outlet fins reduce material costs for the less critical cooling discharge portion.

Inventive Principle:
Principle #40Composite materials

3Weight of moving object

If the fin assembly is made of aluminum with low thermal conductivity, then the cost and weight are reduced, but the cooling efficiency is insufficient

Engineering Contradiction:
Improveweight of fin assemblyVSAvoidcooling efficiency
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

Aluminum alloy material is used specifically in the outlet fin assembly where high thermal conductivity is less critical, as the air exiting this region has already absorbed significant heat. This allows weight reduction in the portion of the system where performance requirements are lower.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The composite design pairs aluminum alloy outlet fins with copper inlet fins, allowing the lighter aluminum material to be used in the outlet section without compromising overall system performance, since the critical heat transfer function is handled by the copper inlet portion.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The fin structure achieves high cooling efficiency, low cost, and light weight by utilizing materials optimized for rapid heat transfer and airflow cooling, enhancing thermal management of electronic components.

Implementation Method 1

a thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly... heat generated by a heat source may be transferred to the inlet fin assembly rapidly and effectively

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat generated by a heat source may be transferred to the inlet fin assembly rapidly and effectively... cool air with relatively low temperature exchanges heat with the inlet fin assembly

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

cool air blew from the outside of the fin structure has not absorbed the heat from the fin structure... cool air with relatively low temperature exchanges heat with the inlet fin assembly

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20260078964A1Fin structure
Publication Date: 2026.03.19 PURPLE CLOUD DEV PTE LTD
  • US20260078964A1 patent drawing
  • US20260078964A1 patent drawing
  • US20260078964A1 patent drawing

AI summary

A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.