Dual-Mode Stage Elevation for High-Load Wafer Testing
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Solution Overview
Problem
Existing stage technologies in test apparatuses face challenges in efficiently managing large loads applied during wafer testing, particularly when numerous probes come into contact with the wafer, leading to significant torque requirements.
Innovation Solution
The stage incorporates an elevation mechanism with a first adjustment mechanism using a rotational drive of a motor and a second adjustment mechanism that supplies and discharges a pressure medium to adjust the elevation position of the base, thereby distributing and managing the applied loads more effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single motor-driven elevation mechanism is used to raise and lower the base, then the structure is simple, but the torque requirement becomes excessively large when numerous probes contact the wafer
Solution Approach 1:
The elevation mechanism is divided into two independent adjustment mechanisms: a first adjustment mechanism with a motor for positional control and a second adjustment mechanism with a pressure medium for load support. This segmentation allows each mechanism to handle specific functions, reducing the torque burden on the motor-driven system when probes contact the wafer.
2Measurement precision
If the elevation position is adjusted using only a motor-driven mechanism, then the control is precise, but the load capacity during probe contact becomes insufficient
Solution Approach 1:
The patent combines two adjustment mechanisms working together: the motor-driven mechanism provides precise positional control while the pressure medium mechanism provides additional load support capacity. This merging allows the system to achieve both precise elevation control and sufficient load capacity during probe contact.
3Productivity
If the stage raises the base to contact probes, then the testing function is achieved, but a large load is applied to the stage causing high torque requirements
Solution Approach 1:
The patent introduces a pressure medium (pneumatic or hydraulic system) as the second adjustment mechanism to support the load during probe contact. This pneumatic/hydraulic assistance reduces the torque requirement on the motor-driven system while maintaining the ability to raise the base for testing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise control of the stage's elevation, reducing the torque requirements and enhancing the stage's ability to handle the large loads imposed by the probes during wafer testing, ensuring accurate and reliable testing operations.
Implementation Method 1
a second adjustment mechanism configured to supply and discharge a pressure medium, and to adjust the elevation position of the base through the pressure medium
Data Source
AI summary
A stage includes a base on which a substrate is to be mounted, and an elevation mechanism configured to raise and lower the base. The elevation mechanism includes a first adjustment mechanism configured to adjust an elevation position of the base by rotational drive of a drive motor, and includes a second adjustment mechanism configured to supply and discharge a pressure medium and adjust the elevation position of the base through the pressure medium.