Dual-Mold Pressurizing for Fast Heating-Cooling Bonding
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Solution Overview
Problem
Conventional pressurizing apparatuses require significant time to heat or cool a target object due to the configuration of heaters and refrigerants within the mold, leading to temperature overshoot and inefficient processing.
Innovation Solution
A pressurizing apparatus with a heating lower mold and a cooling lower mold that can be switched by a control device based on processing state, using an intervening pad for flexible deformation and heat insulation, and a vacuum-sealed environment to control temperature and pressure effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater and refrigerant system are used to heat and cool the mold, then temperature control capability is improved, but processing time is significantly extended
Solution Approach 1:
The mold is divided into two separate entities: a heating mold and a cooling mold. This segmentation allows each mold to be optimized for its specific function, enabling rapid temperature switching without the time penalty of heating or cooling a single mold that must perform both functions sequentially.
Solution Approach 2:
Both the heating mold and cooling mold are prepared in advance with their respective temperature control systems. The heating mold is preheated and the cooling mold is pre-cooled before the bonding process begins, eliminating the need to heat or cool the mold during the actual bonding operation.
2Speed
If a heater is used to quickly heat the mold, then heating speed is improved, but temperature overshoot occurs causing unexpected high heat to be added to the target object
Solution Approach 1:
By separating the heating and cooling functions into different molds, the system can rapidly switch between heating and cooling states without the risk of overshoot. The heating mold can be heated quickly to the required temperature, and when cooling is needed, the system simply switches to the pre-prepared cooling mold, eliminating temperature overshoot entirely.
Solution Approach 2:
The intervention pad acts as a thermal intermediary between the heating mold and the target object. It allows rapid heat transfer when heating is required, but can be removed or adjusted to prevent overheating, providing a simple mechanical control mechanism for temperature management.
3Adaptability or versatility
If the soft layer is used to flexibly deform according to the target object shape, then adaptability is improved, but heat insulation performance deteriorates
Solution Approach 1:
The intervention pad is designed with non-uniform structure: a soft layer for conforming to the target object shape and a heat insulating layer for thermal isolation. This local differentiation of properties allows the pad to simultaneously achieve shape adaptability and heat insulation performance in different regions of the same component.
Solution Approach 2:
The intervention pad is constructed as a composite structure combining a soft material layer and a heat insulating material layer. This composite design allows the pad to exhibit both the flexibility needed to conform to various target object shapes and the thermal insulation properties needed to control heat transfer from the heating mold.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for rapid and precise temperature control of the target object, reducing processing time and preventing overheating, while maintaining efficient energy use and preventing air biting during the bonding process.
Implementation Method 1
a heating lower mold that is a lower mold heated beforehand by heating means and is configured to heat the target object while pressurizing it
Implementation Method 2
a cooling lower mold that is a lower mold cooled beforehand by cooling means and is configured to cool the target object while pressurizing it
Implementation Method 3
a heat insulating layer intervening between the soft layer and the target object for thermally insulating between the target object and the soft layer
Data Source
AI summary
A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.