Dual Optical Slit Laser Shaping for High-Precision Drilling

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Solution Overview

Problem

Existing laser processing systems face issues with mask degradation due to high fluence and reduced lifespan when processing materials like glass or ceramics, as the mask is damaged by the focused laser light, especially when high target fluence is required for drilling.

Innovation Solution

The system employs a dual optical slit configuration with separate focusing in two perpendicular directions, using cylindrical lenses to form linear shapes, and a projection optical system to focus laser light through these slits onto the workpiece, reducing the fluence on the slits and extending their lifespan.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a mask is used to pattern laser light for drilling glass or ceramics, then drilling precision is maintained, but the mask degrades rapidly and lifespan is reduced due to high fluence

Engineering Contradiction:
Improvedrilling precisionVSAvoidmask lifespan
Core Design Contradiction:
Manufacturing precisionVSDuration of action of stationary object

Solution Approach 1:

The patent extracts the patterning function from a physical mask and implements it using optical slits formed directly in a beam shaping element. This eliminates the mask from the optical path, preventing mask degradation while maintaining precise patterning capability through the slit geometry

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a beam shaping element with optical slits as an intermediary between the laser source and workpiece. This element performs the patterning function that would otherwise require a mask, while being positioned in the beam path to shape light before it reaches the workpiece, avoiding direct exposure to high fluence at the patterning element

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If high target fluence is used for drilling glass or ceramics, then drilling efficiency is improved, but damage to optical components increases

Engineering Contradiction:
Improvedrilling efficiencyVSAvoidoptical component damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating highly localized intensity distribution through optical slits. The beam shaping element concentrates energy precisely where needed in the focal plane while keeping the fluence at the slit locations manageable, enabling high drilling efficiency without excessive damage to optical components

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent transforms the beam profile from a conventional circular cross-section to linear shapes through cylindrical lenses and optical slits. This dimensional transformation in the beam geometry enables precise energy confinement in the focal plane, improving drilling efficiency while distributing the fluence load away from vulnerable optical components

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration minimizes damage to the optical slits, allowing for efficient and prolonged use of the laser processing apparatus while maintaining high-quality drilling precision.

Implementation Method 1

a first light focusing optical system configured to focus the laser light in the first direction so as to form laser light having a first linear shape

Methodology Applied
Scientific EffectLight focusing: Focusing

Implementation Method 2

a second light focusing optical system configured to focus the laser light in the second direction so as to form laser light having a second linear shape

Methodology Applied
Scientific EffectLight focusing: Focusing

Implementation Method 3

a projection optical system configured to bring the laser light passing through the first and second optical slits into focus at a surface of the workpiece

Methodology Applied
Scientific EffectLight focusing: Focusing

Implementation Method 4

The excimer laser light having photon energy higher than the chemical binding energy of a polymer material can unbind the chemically bonded molecules that form the polymer material

Methodology Applied
Scientific EffectPhotochemical bond breaking: Photodissociation

Implementation Method 5

Glass, ceramic, and other materials absorb excimer laser light by a large amount

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS20250235958A1Laser processing apparatus, laser processing system, and method for manufacturing electronic devices
Publication Date: 2025.07.24 GIGAPHOTON INC
  • US20250235958A1 patent drawing
  • US20250235958A1 patent drawing
  • US20250235958A1 patent drawing

AI summary

A laser processing apparatus includes: a first optical slit disposed at a first position in an optical path of laser light and having an opening extending in a second direction; a second optical slit disposed at a second position and having an opening extending in the first direction; an illumination optical system including a first light focusing optical system that focuses the laser light in the first direction to form laser light having a first linear shape and irradiates the first optical slit with the laser light, and a second light focusing optical system that focuses the laser light in the second direction to form laser light having a second linear shape and irradiates the second optical slit with the laser light; and a projection optical system that brings the laser light passing through the first and second optical slits into focus at a surface of a workpiece.