Welding/Soldering/Cutting Articles TRIZ Cases

Blue laser welding with tapered jig pressing keeps copper foil gaps uniform, improving weld quality, conductivity, and breakage resistance.

A split-beam laser with wavelength conversion forms dicing grooves and removes Low-k film while suppressing leaked light that causes interface peeling.

Laser melting creates up to 1 µm copper surface variation, improving plating adhesion and finish without slow mechanical roughening.

Long-pulse, quasi-CW laser cutting with non-reactive gas limits heat buildup, reducing burrs and heat-affected zones in thick metal cuts.

Pre-etched substrate grooves replace post-deposition scribing to avoid layer shorts, particles, and cracks while improving solar cell output.

A space light modulator shapes and shifts the laser focus in depth to form inclined wafer fractures for precise semiconductor chip separation.

Preformed modified traces absorb a second laser to guide crack growth in off-axis silicon carbide and stabilize longitudinal crack length.

Laser cleaning, cutting, welding, and finishing join metal sheets with strong welds, low thickness variation, and fewer surface defects.

Modified Airy beams create curved defects in transparent workpieces, enabling particle-free formation of non-square glass edges with high throughput.

Grooves and embedded rods reinforce metal beams at high-stress areas, raising strength and ductility without the weight and cost of full reinforcement.

An annular recess stamped during friction stir spot welding reveals shoulder wear on the joined surface without stopping for tool inspection.

Local electric heating and yield-level pressure enable solid-phase metal bonding with accurate temperature control and no sliding.

Replacing mechanical roughening with laser melting creates a uniform copper matte surface that improves plating adhesion with less processing time.

Laser-textured metal surfaces with controlled peak curvature help thermoplastic resin bond tightly and improve joint airtightness.

Alternating joining points and gaps let ultrashort laser pulses control heat buildup, reducing stress cracks while maintaining seam strength.

Pulse laser oxidation creates metal oxide clusters that directly bond thermoplastic resin to metal without adhesives, rivets, or wet steps.

An inert gas purge around both sides of the friction stir weld displaces oxygen, reducing oxide defects in aluminum alloy joints.

A two-step spot welding process adds same-point heat treatment to strengthen martensitic joints without slowing series production.

Sensor and machine learning feedback predicts weld defects before joining, stabilizing battery laser welding under misalignment and contamination.

Rotational shear and axial extrusion mix metal with NCCF to form strong conductive extrusions with lower energy use and no brittle interfaces.

A one-sided groove with filler and layered laser passes joins thick steel plates while cutting bevel machining time and cost.

One-sided groove filling lets thick steel plates be laser welded with less joint machining, lower cost, and reliable fusion quality.

Pulsed laser treatment forms a uniform 5-700 nm oxide layer on aluminum, improving bonding and corrosion resistance without chemical pretreatment.

An angled shielding plate blocks split polygon-mirror beams to keep groove depth uniform and protect optical components during steel sheet laser processing.

Spiral laser-formed modification layers reduce wafer eccentricity, improving separation accuracy and peripheral trimming quality.

Outer-intensity laser shaping suppresses taper in microvias and recesses, enabling finer semiconductor substrate patterns with lower wiring resistance.

Spot and laser welding are combined so weld beads bridge nuggets to the standing wall, reducing stress concentration and torn-open deformation.

Laser scoring and pre-punch flattening create a predictable separation line in sheet material, cutting tool wear while preserving edge quality.

A controlled shoulder gap and excess filler let softened material fill corner fillets without shoulder scratching or surface defects.

A single laser beam melts the lower-melting metal with auxiliary powder and wire to create strong dissimilar-metal butt joints without V-groove machining.

Laser-formed internal peel-off layers replace wire sawing in gallium oxide, cutting waste while enabling precise thin substrate separation.

Controlled carbon diffusion at the steel joint interface raises strength and wear resistance while preserving ductility and toughness.

Mold-formed protrusions guide sealer flow during cast-part joining, reducing random spread, sealer waste, and bolt fastening failures.

Axial speed and preset time replace noisy current spikes to detect second-workpiece contact more precisely during friction stir spot welding.

A translating tray and pivoting treatment head shrink the cutting zone, simplify cleaning, and reduce contamination risk in food cutting.

Seebeck-based temperature sensing detects contact with the higher-melting workpiece during dissimilar-metal FSW to stabilize the weld in real time.

Photon-written metastable metal particle grids store high-entropy key patterns, then use triggered phase relaxation as a predictable physical timer.

A pulsed multi-pass UV laser pattern limits thermoplastic heat buildup and melting while preparing surfaces for primer, topcoat, and strong adhesion.

A positive-pressure purge-gas shroud keeps laser optics clear while removing plume, fumes, and effluent from the ablation path.

Multi-pass pulsed UV laser ablation prepares thermoplastic surfaces for primer and topcoat while limiting heat buildup and melting.

Perpendicular slit beam shaping lowers fluence on optical slits, extending component life while preserving precise laser drilling in glass and ceramics.

Tangential laser machining of rotating ceramic blanks improves wire bonding capillary surface finish while speeding small-structure formation.

Heating steel above its A1 point during friction welding lets it anchor into aluminum, improving tensile-shear and peel strength.

Ultrashort-pulse laser ablation cuts multilayer fuel cell stacks precisely without blade wear, contamination, or costly pattern-specific tooling.

Increasing gas flow toward the groove's closed end clears CFRP machining plume, limiting heat-affected layers and accuracy loss.

A deeper second pass re-fluidizes the overlap zone in friction stir welding to restore material intake and prevent front-surface defects.

Grouped pulse modes break growing debris and suppress molten debris during wafer groove formation, improving chip quality and throughput.

Laser beam shaping with diffraction, phase retardation, and focusing minimizes side-edge curvature differences while preserving thin, strong display substrates.

Timed pulse groups sustain plasma to break growing debris during groove formation while limiting melted debris and heat buildup.

A pulsed laser forms a local fusion zone in an intermediate layer, bonding optical crystals to mismatched substrates without high-temperature delamination.