Laser Surface Texturing of Copper Plates for Faster Plating Adhesion
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Solution Overview
Problem
Mechanical roughening of copper surfaces for improved adhesion and uniformity in plating processes is time-consuming and inefficient.
Innovation Solution
A laser surface modification method that cleans and slightly melts the copper surface to create a uniform topography with variations up to one micron, enhancing adhesion without mechanical roughening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical roughening is used to improve adhesion and uniformity, then plating adhesion is improved, but processing time increases
Solution Approach 1:
The patent replaces mechanical roughening systems with a laser-based surface modification system. The laser beam melts and resolidifies the copper surface to create a roughened topography without mechanical contact, thereby improving plating adhesion while eliminating the time-consuming mechanical roughening process.
Solution Approach 2:
The patent utilizes the phase transition of copper from solid to liquid and back to solid through controlled laser heating and rapid cooling. The laser beam melts the copper surface locally, and upon rapid cooling, the molten copper solidifies into a roughened surface structure that enhances adhesion without requiring mechanical intervention.
2Reliability
If mechanical roughening is applied to increase surface area, then adhesion properties improve, but process complexity increases
Solution Approach 1:
The patent replaces complex mechanical roughening equipment with a laser surface modification system. The laser beam, controlled by software and positioning systems, creates the desired surface roughness through controlled melting and resolidification, simplifying the overall process while achieving the same adhesion improvement.
Solution Approach 2:
The patent changes the physical state parameters of the copper surface through laser heating. By controlling the laser power, scanning speed, and pass number, the process transforms the surface morphology from smooth to roughened, creating increased surface area and improved adhesion properties without mechanical contact.
3Manufacturing precision
If highly polished copper surface is used, then surface quality is improved, but plating adhesion deteriorates
Solution Approach 1:
The patent applies controlled phase transitions to the highly polished copper surface using laser heating. The laser beam locally melts the smooth surface, and rapid cooling creates a roughened topography with increased surface area. This transforms the surface from a smooth, non-adhesive state to a roughened, adhesive state while maintaining overall surface quality.
Solution Approach 2:
The patent applies partial melting to only the surface layer of the copper substrate rather than the entire material. The laser beam selectively melts a thin surface layer (creating variations up to one micron), which upon resolidification provides the roughened texture needed for adhesion while leaving the bulk material and overall surface integrity intact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser method increases the surface area and promotes better plating adhesion, providing a shiny to matte finish efficiently, suitable for immersion plating solutions like silver or tin.
Implementation Method 1
applying a laser beam to the surface of the copper substrate
Implementation Method 2
modifying the surface of the copper substrate to vary the surface up to one micron
Data Source
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AI summary
A laser system (102) emits a laser beam (148) at a surface (202) of a substrate (111) to modify the surface. The substrate is cleaned to increase reflectivity of the surface. The laser beam is applied to the surface. The laser beam moves across the surface of the substrate. The surface is modified by the laser beam to vary the surface up to one micron, or 1 µm. A surface area of the surface is increased by the variations. The laser beam is stopped after modification of the surface of the substrate is complete.