Dual-Path Laser Edge Processing for Substrate Film Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing methods fail to effectively remove edge beads and attached by-products from semiconductor wafers and glass panels, leading to reduced manufacturing yield and surface contamination due to inadequate film removal at the edges.
Innovation Solution
A substrate processing apparatus and method utilizing a laser generation unit to split a laser beam into two paths, with distinct beam shaping and scanning units for the upper and lower edges, allowing for simultaneous processing with varying film conditions by adjusting beam shape, energy per unit area, and scanning speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a chemical is dispensed to remove edge bead, then the edge bead removal process is performed, but the film removal is not appropriate and pin marks are formed on the substrate surface
Solution Approach 1:
The patent replaces the chemical dispensing method with a laser-based processing system. The laser beam is focused on the edge region of the substrate to remove the film and edge bead, eliminating the formation of pin marks and inappropriate film removal associated with chemical methods. This substitution of chemical processing with laser processing resolves the contradiction between ease of manufacture and manufacturing precision.
2Device complexity
If a single laser beam path is used to process substrate edges, then the device complexity is reduced, but the ability to handle different film conditions on upper and lower edges is limited
Solution Approach 1:
The patent divides the single laser beam into multiple separate paths using beam splitters, with each path equipped with independent beam shaping and scanning units. This allows different beam parameters (shape, energy, scanning speed) to be applied to different regions of the substrate, enabling adaptation to varying film conditions on upper and lower edges while maintaining a unified laser source.
Solution Approach 2:
The patent implements dynamic control of laser beam parameters through independent beam shaping units and scanning speed controls for each path. The beam shapes, energies, and scanning speeds can be adjusted in real-time based on the specific film conditions being processed, providing adaptability without requiring multiple fixed laser sources.
3Productivity
If the laser beam energy per unit area is increased to improve film removal efficiency, then the processing speed increases, but the risk of substrate damage and contamination increases
Solution Approach 1:
The patent applies different energy densities to different regions of the substrate by using beam shaping units that create non-uniform beam profiles. The beam energy is concentrated on the film and edge bead regions while maintaining lower energy on the underlying substrate, enabling efficient film removal without causing substrate damage or contamination.
Solution Approach 2:
The patent uses pulsed laser operation with controlled scanning speeds to deliver energy in periodic bursts rather than continuous exposure. This allows the material to respond to each pulse for effective removal while the scanning motion prevents excessive energy accumulation that could damage the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances substrate processing efficiency by effectively removing edge beads and by-products from both upper and lower edges, even when film conditions differ, thereby improving manufacturing yield and preventing surface contamination.
Implementation Method 1
a laser generation unit that generates a laser beam to process the film to be removed
Implementation Method 2
a beam splitter that splits the laser beam emitted from the laser generation unit and guided to the beam splitter into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate
Data Source
AI summary
An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.