Welding/Soldering/Cutting Articles TRIZ Cases

A thin nickel interlayer enables diffusion bonding of beryllium copper while limiting Kirkendall voids and cracks after heat treatment.

An intermediate body and vaporizing foil actuator join dissimilar or heat-sensitive metals without fusion heat, brittle intermetallics, or large heat-affected zones.

Split laser paths independently shape and scan upper and lower substrate edges to remove edge beads and by-products without surface contamination.

A sea-island eutectic weld structure helps Cu-Al joints raise joining strength while limiting brittle intermetallic compound formation.

Local electric heating at the weld interface plus yield-level pressure enables lower-temperature solid-phase metal bonding with minimal heat-affected zones.

Assist gas redirects melted plating metal onto the cut face during laser cutting, avoiding pre-removal and added rustproofing steps.

Flash butt welding for Al-Si coated press hardened steel expels aluminum oxides into the flash, improving weld strength and ductility.

A thin soluble interlayer dissolves oxides and asperities, enabling refractory metal bonding at lower temperature and pressure.

Ultrashort laser pulses locally harden stressed glass regions while preserving optical properties and avoiding full-surface treatment.

Closely spaced laser-drilled holes and controlled heating guide crack growth for flatter substrate cuts with less force and fewer irregular edges.

Controlled migrant-element and phosphorus-rich subsurfaces lower contact resistance, improve bond durability, and extend spot-welding electrode life.

Beam width is adjusted from surface and structure data so laser energy stays within wafer streets without blockage or quality loss.

By suppressing chromium nitride during hot rolling, this clad steel case preserves corrosion resistance and toughness without solution heat treatment.

Controlled laser heating creates internal detachment zones that separate thin solid layers with less waste, surface damage, and thermal stress.

Automated filling, laser sealing, and helium leak inspection enable high-purity alkali metal heat pipe arrays to be produced at scale.

Pulsed laser welding compensates focus delocalization in transparent semiconductor workpieces to place peak energy at the interface for repeatable bonding.

Burst UV laser trenches with varying depth dice optical substrates into smooth slanted-edge dies while reducing chipping and preserving strength.

A defined cavity between overlapping coated sheets vents zinc vapor at the weld edge, reducing spatter and preserving laser weld quality.

Controlling laser energy density keeps reformed sections at the planned cutoff depth, reducing material loss and improving wafer yield.

Offset laser entry and exit points from irregular panel edges to limit sputtering, protect circuit structures, and improve display yield.

Embedded indicator materials expose seal breaches in switchable films early while the dual-seal layout blocks water and gas ingress.

Different shoulder and pin materials control frictional heat and stress, extending friction stir welding tool life for steel joining.

UV laser scanning replaces sandblasting stencils to create clear, precise glass identification marks, including thin features and continuous rings.

Combining galvo scanning with acousto-optic deflection enables fast beam dithering, power control, and precise feature shaping with lower thermal damage.

Multiple branched hollowing beams and one condenser lens deepen wafer street machining while limiting heat buildup, backfilling, and tact time.

Medium-entropy alloy particles and hot-roll bonding improve interface stability, strength, and ductility in a lightweight 2024Al composite panel.

Automated laser ablation in a sealed chamber trims precious metal ingots to nominal weight while avoiding remelting, manual error, and surface damage.

A bridging molten pool lets adjacent metal end portions be welded despite gaps or level differences, cutting preprocessing time and cost.

Hot isostatic pressing bonds clad to solid steel rotors with source-layers that limit alloy depletion and strengthen high-speed rotor joints.

Controlled laser spot positioning forms inclined wafer fractures that stop short of the opposite surface, reducing chipping during grinding.

Selectable axicon and facet lenses let one laser head switch gaussian, flat, and ring beam profiles while stopping emission during movement.

A soft buffer between the horn and joining members improves ultrasonic energy transfer while reducing horn damage and supporting reliable joining.

A double axicon forms a ring beam and long line focus for brittle transparent workpieces while avoiding axicon damage and easing alignment.

Offset caustics from two overlapping laser beams widen the process window and keep laser line focus stable without lens readjustment.

Temporary apertures feed fresh etchant into long microchannels, then melt-seal into integral plugs for uniform sections in transparent substrates.

A stepped rotary pin holds down plasticized metal during friction stir welding of different-thickness members to limit burrs and improve joint strength.

Discrete laser peening points create tensile and compressive stress regions that raise surface strength while suppressing bending in metal workpieces.

Friction stir welding joins narrow aluminum sheets and posts into a rigid, watertight cargo container sidewall without rivets or adhesives.

Parallel partial laser beams with depth-based power adjustment sustain deep-cut ablation speed, reduce repeated sweeps, and improve edge quality.

A variable margin adapts each cut piece to fabric pitch variation, preventing overlap and reducing material loss in automated layout.

A consumable tapered bit with a non-cutting tip stays in the joint to avoid retraction voids and leave a flush surface without finishing.

Transforms the engraving pattern into the laser frame to mark a fast-moving paper web precisely while limiting heat damage and preserving sharp angles.

A shockwave-driven material jet joins metals and polymers at micron scale while avoiding the thermal damage common in laser-based joining.

A liquid barrier coating enables oxide removal before diffusion bonding, then evaporates cleanly to preserve bond strength without harsh cleaning.

Force and pulsed current bond protected metal surfaces, pushing out gaps and contaminants for stronger welds with lower heat.

Laser-shaped internal modifications enable one-sided anisotropic etching of substrate recesses with low roughness and no opposite-surface damage.

A non-condensing lens section lets divided corner beams pass unfocused, preserving groove depth uniformity and preventing optical contamination.

A deformable weldable stud is driven into non-weldable material to create a larger welding head, avoiding pre-punching and improving joint loadability.