Substrate Cutting via Laser Hole Arrays and Thermal Crack Propagation

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Solution Overview

Problem

Laser cutting methods for substrates often result in irregular cutting tracks and uneven planes, leading to damage or scrap when trying to achieve small cut sizes, as they rely on external forces and mechanical cleaving which can be inefficient and inaccurate.

Innovation Solution

A method and equipment that uses a laser beam to form holes with a pitch of less than or equal to 20 micrometers along a cutting path, inducing thermoelastic stress to create cracks which propagate and facilitate the splitting of the substrate without the need for external tools or significant force, using a system comprising a laser generating device, heating device, and control module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If laser ablation method is used to cut substrate, then cutting can be achieved, but cutting speed is slow because laser heats and vaporizes material along entire cutting path

Engineering Contradiction:

Improvecutting speedVSAvoidlaser energy consumption

Core Design Contradiction:

SpeedVSUse of energy by stationary object

Solution Approach 1:

The patent divides the cutting process into two stages: first forming discrete holes along the cutting path, then propagating cracks between these holes through thermal stress. This segmentation allows the laser to act only at discrete points rather than continuously along the entire path, significantly reducing energy consumption and increasing speed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary hole formation along the cutting path before completing the actual cut. These pre-formed holes serve as stress concentration points that facilitate subsequent crack propagation, allowing the cutting process to be completed more efficiently with less energy.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If laser cutting groove or crack method with mechanical cleaving is used, then cutting can be accelerated, but cut sheets are prone to irregular cutting tracks and uneven cutting planes

Engineering Contradiction:

Improvecutting efficiencyVSAvoidcutting track regularity and plane uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical cleaving system with a thermal field system. Instead of using physical contact between a cleaving knife and substrate, the patent uses controlled thermal stress to propagate cracks along the desired cutting path, eliminating the irregularities caused by mechanical contact.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and parameters of the substrate by controlled heating. By precisely controlling the thermal parameters (temperature distribution, heating rate), the patent achieves consistent crack propagation and uniform cutting planes, eliminating the variability associated with mechanical cleaving.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If external force is applied to substrate to split it after laser groove formation, then cutting can be completed, but significant force is required and cutting precision is reduced

Engineering Contradiction:

Improvecutting completionVSAvoidexternal force required

Core Design Contradiction:

ProductivityVSForce

Solution Approach 1:

The patent utilizes thermal expansion and thermoelastic stress to propagate cracks through the substrate. By locally heating the substrate around the pre-formed holes, the patent generates controlled thermal stress that causes cracks to propagate along the cutting path, eliminating the need for significant external mechanical force.

Inventive Principle:

Principle #37Thermal expansion

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for precise cutting and separation of substrates along a cutting path with flat cutting planes, reducing the need for external tools and minimizing force required, thereby overcoming the issues of irregular cuts and uneven planes in traditional laser cutting methods.

Implementation Method 1

the laser beam produces a plurality of cracks due to thermoelastic stress while forming the plurality of holes

Methodology Applied

Scientific EffectThermoelastic stress: Thermal Expansion

Implementation Method 2

Laser cutting mainly uses the laser to evaporate the material, so as to cut a workpiece

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20230158608A1Equipment and method for cutting substrate

Publication Date: 2023.05.25 SKIILEUX ELECTRICITY INC

AI summary

A method for cutting substrate includes the steps of forming a cutting path on a substrate, applying a laser beam onto the substrate to form a plurality of holes with a pitch less than or equal to 20 micro meters along the cutting path, increasing the temperature of an area of the substrate containing the plurality of holes, and if necessary, applying force to separate the substrate along the plurality of holes. An equipment for cutting substrate includes a carrying platform, a laser generating device, a heating device, and a control module. The carrying platform is used for carrying a substrate. The laser generating device can generate a laser beam. The control module can control the laser beam generated by the laser generating device to move on the substrate along a track, and then guide the heating device to heat the substrate along the track.