Dual Row I/O With Embedded Logic For Uniform Interconnects
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Solution Overview
Problem
Current microprocessor chip designs face challenges in achieving high density and reliability due to large I/O cell footprints and inconsistent connection lengths, which lead to signal loss and performance issues, while also being costly and inefficient.
Innovation Solution
The design features a dual row I/O configuration with uniform interconnect lengths between PHY logic and I/O cells, and between the bus and I/O cells, using techniques like solder bumps and routing channels to ensure consistent high-speed connections and optimized footprint utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional single-row I/O cell arrangement is used, then layout simplicity is maintained, but footprint area is excessively large
Solution Approach 1:
The patent transitions from a single-row I/O cell arrangement to a dual-row stacked configuration, utilizing the vertical dimension (z-axis) by stacking I/O cells atop one another. This dimensional change reduces the horizontal footprint area while distributing I/O cells across multiple layers, effectively resolving the contradiction between minimizing footprint and maintaining layout simplicity.
Solution Approach 2:
The patent implements nesting by placing one row of I/O cells directly atop another row, creating a compact stacked structure. This nested arrangement allows multiple I/O cells to occupy overlapping horizontal space across different layers, significantly reducing the overall footprint area while organizing cells in a systematic manner.
2Area of stationary object
If dual-row stacked I/O cells are used, then footprint density is improved, but connection length consistency deteriorates
Solution Approach 1:
The patent employs asymmetric routing strategies where different interconnect paths are designed with compensating characteristics. Specifically, connections from the top row of I/O cells and bottom row to the PHY logic are routed with different geometric paths but engineered to achieve matched electrical lengths, thereby maintaining connection consistency despite the asymmetric stacked layout.
Solution Approach 2:
The patent applies local quality by optimizing interconnect characteristics in different regions of the chip. Different routing channels and interconnect structures are designed for top-row versus bottom-row I/O cells, with locally adjusted parameters such as trace width, length, and routing paths to ensure that all connections achieve uniform signal propagation characteristics despite their different physical locations.
3Power
If larger I/O cell geometries are used, then drive capability is improved, but cell footprint increases
Solution Approach 1:
The patent resolves the contradiction by stacking I/O cells in the vertical dimension, allowing larger geometry cells to be placed atop one another rather than side-by-side. This enables each I/O cell to have sufficient area for strong drive capability while the overall footprint is reduced because multiple large cells occupy overlapping horizontal space across different layers.
Solution Approach 2:
The nested stacking arrangement allows large-geometry I/O cells to be positioned in overlapping horizontal footprints across different layers. Each cell maintains its full size for adequate drive capability, but the nested configuration ensures that the combined footprint of multiple large cells is equivalent to or less than a single cell, thereby resolving the area contradiction.
Data Source
AI summary
The present invention provides for a method and circuit of an integrated circuit (IC) having dual row input/output (I/O). The circuit having a plurality of dual I/Os including an upper row of I/O and a lower row of I/O, with logic arranged in communication between the upper and the lower rows of the dual row I/O. The connectivity with the logic circuits of the present invention therefore provides for improving reliability and performance through more similar and uniform pathway connections. Advantageously, the present invention also provides for the reallocation of valuable footprint space as the logic is embedded within the dual row I/O thereby creating additional footprint space for further performance and other beneficial gain where interconnects as between the physical layer (PHY) logic and I/O cells are generally similar in length.