Dual Seal Ring Wafer Structures for Die Gap Interconnection
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Solution Overview
Problem
Conventional semiconductor fabrication methods leave significant wasted space between dies on wafers, which could be utilized to enhance die functionality or versatility.
Innovation Solution
Implementing dual seal ring structures and conductive elements to electrically interconnect IC dies, utilizing otherwise empty space for additional functionalities and improving chip area utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional fabrication methods are used, then manufacturing simplicity is maintained, but chip area utilization is reduced due to wasted space between dies
Solution Approach 1:
The patent merges the protective seal ring function with the interconnection function by forming conductive elements within the seal ring structure. The seal ring serves dual purposes: protecting the die from external elements and providing electrical interconnection to adjacent dies, thereby eliminating wasted space and improving chip area utilization without proportionally increasing fabrication complexity
Solution Approach 2:
The seal ring structure is designed to perform multiple functions simultaneously: mechanical protection against external elements, electrical interconnection between dies, and structural support for conductive elements. This multi-functionality allows the same structure to address both protection and interconnection needs, improving productivity without linearly increasing device complexity
2Adaptability or versatility
If dual seal ring structures with conductive elements are implemented, then chip area utilization is enhanced, but device complexity increases
Solution Approach 1:
The patent combines the seal ring structure with conductive interconnection elements, allowing the same structure to provide both protection and electrical connectivity. This merging enables additional functionalities such as die-to-die interconnection and access to gap regions without requiring separate dedicated structures, thereby enhancing adaptability while controlling the increase in device complexity
3Productivity
If empty gap regions are utilized for interconnections, then productivity improves, but manufacturing precision requirements increase
Solution Approach 1:
The seal ring structure acts as an intermediary that facilitates the placement of conductive elements in the gap regions. By providing a defined structural framework, the seal ring enables precise positioning of conductive elements without requiring ultra-precise direct placement, thereby improving productivity while managing manufacturing precision requirements
Data Source
AI summary
A first die includes a plurality of first transistors. A first seal ring surrounds the first die in a top view. A second die that a plurality of second transistors. A second seal ring surrounds the second die in the top view. A plurality of conductive elements extends into both the first die and the second die in the top view. The conductive elements electrically interconnect the first die with the second die. A third seal ring surrounds, in the top view, the first die, the second die, and the conductive elements.