Dual Side Cooling Power Device Package with Thermal Clip
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Solution Overview
Problem
Small semiconductor packages with short leads face challenges in heat dissipation, leading to unreliable operation, and occupy excessive space on circuit boards, particularly in synchronous buck converter circuits.
Innovation Solution
A dual side cooling integrated power device module is developed, featuring a leadframe structure with spaced pads and common source-drain leads, flip-chip attached transistors, and thermal clips for enhanced heat dissipation and reduced parasitic resistances, while minimizing board space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If small packages with short leads are used, then the electronic circuits become compact, but the heat dissipation capacity becomes insufficient
Solution Approach 1:
The patent introduces a dual-side cooling approach by adding heat sinks to both the top and bottom surfaces of the package, transitioning from single-sided to multi-sided heat dissipation. This dimensional expansion allows effective heat removal from power devices while maintaining a compact package footprint, directly resolving the contradiction between small package size and sufficient heat dissipation capacity.
2Ease of operation
If conventional packages with wire bonds are used, then electrical connections are established, but the amount of space required on the circuit board increases
Solution Approach 1:
The patent integrates multiple functions into a single compact module: power devices, heat sinks, and electrical connections are combined in one integrated package. The leadframe structure provides both mechanical support and electrical pathways, eliminating the need for separate wire bonds and reducing the overall board space required while maintaining full electrical connection capability.
3Temperature
If heat sinks are attached to power devices, then heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The leadframe structure serves multiple functions simultaneously: it provides mechanical support for the power devices, establishes electrical connections between components, and acts as a thermal pathway to conduct heat from the devices to the heat sinks. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation and reduces parasitic resistances, ensuring reliable operation and compact packaging for power devices in synchronous buck converter circuits.
Implementation Method 1
thermal clips for enhanced heat dissipation
Data Source
AI summary
An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and second pads, wherein the source of said second transistor is electrically connected to said one or more common source-drain leads, and a first clip attached to the drain of said first transistor and electrically connected to said one or more common source-drain leads. In another embodiment a partially encapsulated power quad flat no-lead package having an exposed top thermal drain clip which is substantially perpendicular to said with a folded stud exposed top thermal drain clip, and an exposed thermal source pad.