Dual-Side Light-Emitting Device with Anti-Parallel Stacks
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Solution Overview
Problem
Conventional light-emitting diode designs often result in waste of the light-emitting area due to only parts of the light-emitting units being active at a time, leading to inefficient light extraction.
Innovation Solution
A light-emitting device design where light-emitting stacks are electrically connected via a first connecting structure on one surface and a rectifying device or passive components are integrated on the opposing surface, with a heat dissipation layer and electrical connections optimized for efficient power conversion and heat management, using materials like tantalum nitride, silicon-chromium alloy, and high thermal conductivity materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional AC light-emitting diode designs are used with serially connected light-emitting units, then the device can be applied to alternative current directly, but only parts of the light-emitting units emit light at the same time causing waste of the light-emitting area
Solution Approach 1:
The light-emitting units are divided into multiple groups (first light-emitting units and second light-emitting units) that are arranged in anti-parallel connection. This segmentation allows different groups to be activated during different half-cycles of the AC waveform, ensuring that light-emitting units are distributed across both surfaces of the substrate and can all contribute to light emission over time.
Solution Approach 2:
The patent transitions from a single-sided light-emitting configuration to a dual-sided configuration by placing light-emitting units on both the first surface and the second surface of the substrate. This dimensional change allows both surfaces to contribute to light emission, effectively doubling the light-emitting area utilization while maintaining AC compatibility through anti-parallel connection arrangements.
2Device complexity
If light-emitting units are arranged to emit light sequentially in conventional designs, then the circuit can be simplified, but the light extraction efficiency is reduced due to wasted light-emitting area
Solution Approach 1:
The patent merges the light-emitting functions of both surfaces of the substrate by integrating light-emitting units on the first surface and second surface into a unified AC-driven system. The anti-parallel connection configuration allows both surfaces to work together, with each surface's light-emitting units activated during appropriate AC half-cycles, thereby combining their light extraction capabilities rather than having one surface remain idle.
Solution Approach 2:
By arranging light-emitting units in anti-parallel connections across both surfaces and driving them with AC current, the system ensures continuous useful action throughout the AC cycle. During each half-cycle, different groups of light-emitting units are activated, ensuring that light emission continues without interruption and that the entire light-emitting area contributes to the overall light output over complete AC cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design maximizes the light-emitting area by ensuring all light-emitting stacks are active simultaneously, enhancing light extraction efficiency and reducing waste, while also improving power conversion and heat dissipation, suitable for various applications including lighting systems and display backlights.
Implementation Method 1
The light-emitting mechanism of the light-emitting diode is to take advantage of the energy difference of electrons between the n-type semiconductor and the p-type semiconductor and then to release the energy in the form of light
Implementation Method 2
a heat dissipation layer and electrical connections optimized for efficient power conversion and heat management
Data Source
AI summary
This disclosure discloses a method of manufacturing a light-emitting device, comprising proving a single growth substrate having a first major surface and a second major surface; forming a plurality of light-emitting stacks on the first major surface, wherein the light-emitting stacks are electrically connected to each other in series via a first electrical connecting structure; forming an electronic device on the second major surface; and forming a second electrical connecting structure extending from the first major surface to the second major surface and electrically connecting the first light-emitting stacks and the electronic device, wherein the electronic device comprises a resistance, an inductance, capacitance, or a rectifying device, and wherein the material of the resistance comprises tantalum nitride (TaN), silicon-chromium alloy (SiCr), or nickel-chromium alloy (NiCr).