Dual-Sided Encapsulated Substrate for Waterproof Touch-Light Integration
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Solution Overview
Problem
Existing electronic devices face challenges in integrating pressure touch and light emitting assemblies into a single, reliable, and cost-effective structure that provides waterproof and dustproof protection while maintaining a decorative function.
Innovation Solution
An electronic device is constructed with a substrate having electronic assemblies on both sides, covered by a plastic layer, utilizing perforated holes and mold positioning to integrate the assemblies without additional adhesives, ensuring waterproofness, dustproofness, and low production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pressure touch assembly and light emitting assembly are integrated into a single structure, then maintenance convenience and manufacturing ease are improved, but structural complexity and reliability requirements increase
Solution Approach 1:
The patent integrates the pressure touch assembly and light emitting assembly into a single electronic device structure. The substrate carries both electronic assemblies on its first and second surfaces, merging multiple functional components into one integrated unit that simplifies manufacturing and maintenance while achieving waterproof and dustproof protection through the plastic layer encapsulation.
2Reliability
If electronic assemblies are protected by plastic layer, then waterproofness and dustproofness are improved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is pre-provided with perforated holes before the plastic layer is applied. These pre-formed holes allow the plastic layer to be accurately positioned and molded around the electronic assemblies, ensuring proper alignment and reducing manufacturing precision requirements during the encapsulation process while maintaining reliable waterproof and dustproof protection.
3Ease of manufacture
If electronic assemblies are arranged on both sides of substrate, then production cost is reduced, but device complexity increases
Solution Approach 1:
The patent utilizes both the first surface and second surface of the substrate to arrange electronic assemblies, effectively using the three-dimensional space of the substrate. This dimensional approach allows more functional components to be integrated without increasing the planar footprint, reducing production costs by eliminating the need for additional assembly layers while managing device complexity through spatial optimization.
Data Source
AI summary
An electronic device includes a substrate and a plastic layer. The substrate has a first surface and a second surface opposite to each other; at least one of the first surface and the second surface is provided with an electronic assembly and a conducting wire; the conducting wire is electrically connected to the electronic assembly; the substrate further has a plurality of perforated holes; and the perforated holes extend to the second surface from the first surface. The plastic layer covers the first surface and the second surface, and fills in the perforated holes. Therefore, the electronic assemblies and the conducting wires can be arranged on both surfaces of the substrate, and the electronic assemblies on the first surface and the second surface both are protected by the plastic layer. In addition, also provided is a method to produce the electronic device.