Dual-Sided Heat Pipe for CPU and GPU Thermal Management
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Solution Overview
Problem
Current electronic devices with separate CPU and GPU boards face thermal challenges due to independent heat pipes, leading to increased system Z-height, cost, and inefficiency in thermal load sharing, as they dissipate heat to the same surface, causing thermal imbalances and inefficiencies.
Innovation Solution
A heat pipe system where one side cools a CPU and the opposite side cools a GPU, utilizing both top and bottom sides for heat dissipation with multiple blowers and fin stacks, allowing for reduced heat pipe count and thinner chassis, while leveraging GPU cooling for CPU when idle and vice versa.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate heat pipes are used for CPU and GPU on different boards, then each heat source can be cooled independently, but the system Z-height increases and cost increases
Solution Approach 1:
The patent combines two separate heat pipe systems into a single shared heat pipe that serves both CPU and GPU cooling functions. The heat pipe is configured to contact both heat sources through thermal interface materials, allowing heat from both components to be dissipated through a unified cooling system, thereby reducing overall system height while maintaining independent cooling capability.
Solution Approach 2:
The heat pipe is designed to perform multiple cooling functions simultaneously - it cools both the CPU and GPU through its different contact points. This multi-functional design allows a single component to replace what would traditionally require two separate heat pipe systems, reducing complexity and Z-height while maintaining effective thermal management for both heat sources.
2Adaptability or versatility
If separate heat pipes are used for CPU and GPU, then each can be optimized independently, but the number of heat pipes increases and cost increases
Solution Approach 1:
The patent merges two separate heat pipe systems into one unified heat pipe structure that contacts both CPU and GPU. This consolidation reduces the total number of heat pipe components from two to one, simplifying the overall system while maintaining the ability to independently manage thermal loads from each heat source through separate thermal interface materials.
3Productivity
If heat is dissipated to the same surface from both CPU and GPU, then thermal imbalances occur and efficiency decreases, but using separate surfaces requires more complex heat pipe configuration
Solution Approach 1:
The patent utilizes the third dimension (vertical/Z-axis) by having the heat pipe extend through the system height to contact both CPU and GPU at different levels. Heat from both sources is transferred to the heat pipe and dissipated through fins extending in the horizontal direction, creating balanced thermal distribution across different spatial dimensions and improving overall thermal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the number of heat pipes needed, lowers system stack-up and cost, maintains balanced skin temperatures, and enhances thermal efficiency by sharing thermal loads across both sides of the heat pipe.
Implementation Method 1
a heat pipe between the first heat source and the second heat source, where the first heat source is coupled to a first side of the heat pipe and the second heat source is coupled to an opposite second side of the heat pipe
Data Source
AI summary
Particular embodiments described herein provide for an electronic device that can be configured to include a first support structure that includes a first heat source, a second support structure that includes a second heat source, and a heat pipe that has a first side and an opposite second side, where the first heat source is coupled to the first side of the heat pipe and the second heat source is coupled to the second side of the heat pipe. In some examples, the heat pipe can be a vapor chamber.