Indirect Heat Exchangers TRIZ Cases

Segmenting the tool into functional layers reduces thermal inertia, allowing independent temperature control across zones without complex fluid routing.

A thermal expansion plate deforms to create an insulating cavity, regulating heat transfer between a solid base and ambient medium.

Cold-forged pure copper vapor chamber directly contacts electronic elements to eliminate thermal paste interfaces.

Segmented boards with flanged grooves circulate cooling liquid through recesses, resolving manufacturing difficulties from surplus material.

A sandwich panel heat pipe uses a three-dimensional ordered open-cellular micro-truss core to transport working fluid phases.

A two-phase thermal conditioning system circulates fluid through an evaporator and condenser to extract heat from lithographic apparatus parts.

Segmented wick sheets with orthogonal vapor and liquid flow channels improve heat dissipation by optimizing working fluid phase change.

Integrating conduits into primary fins creates a 3D fluid path that boosts heat transfer efficiency while reducing volume and weight.

Segmented microtruss structures reduce clogging susceptibility by varying strut density across regions, improving heat exchange reliability.

Flanged hollow shafts seal penetration holes in vapor chambers, preventing vacuum loss and reducing thermal resistance.

A wearable sweat sensor uses a heat pipe to transfer thermal energy from a distant source directly to the sensing region.

Nested tower fins sleeve vapor chamber units to increase turbulence and airflow while reducing resistance in high-performance electronic cooling.

A sensor cooling device uses a heat-conducting layer to transfer thermal energy from the sensing element to a carrier structure.

A modular evaporator-reservoir unit links multiple segments via a common secondary wick to standardize thermal management assembly.

Segmented channels optimize capillary action and phase change to resolve the trade-off between fluid usage and heat dissipation efficiency.

Variable-length holder strips attach to manifolds through soldered flanges, resolving installation adaptability constraints.

Variable aspect ratio wicking structures balance high capillary pressure against viscous losses in thin thermal ground planes.

Segmented thermosiphon modules with detachable partitions enable synchronized updates and reduce manufacturing waste in outdoor communication devices.

Variable dimension heat pipes use blow molding to create adjustable cross-sections that reduce bending losses and improve thermal coverage.

Differentiated groove assemblies balance capillary action and fluid return, preventing structural deformation from working fluid freezing.

Segmented foil slots and light-trap cavities absorb radiant energy while eliminating periodic temperature gradients that cause thermal strains.

A single motor drives air flaps via gears to reduce weight and cost while maintaining independent section control.

A stacking-type header uses a branching flow passage with a straight-line part perpendicular to gravity to distribute refrigerant.

A thermal conducting structure merges a vapor chamber and heat pipe via a metal mesh capillary to enhance fluid circulation.

A filling system uses a cooler and heater to manage ammonia phase transitions within heat pipes.

A pulsating heat pipe circuit system cools multiple power electronic devices using chaotic liquid-vapor plug movement.

Segmented plate bodies linked by flexible connections allow the vapor chamber to fold for compact storage while maintaining heat conduction reliability.

Thermal conduction pillars extend from the evaporator wall into the vapor channel to enhance evaporation at the liquid-vapor interface.

Vapor injection from bypass evaporators creates a driving force that reduces pressure losses in multi-processor cooling loops.

An oscillating heat pipe panel spreads heat across a chassis to create an isothermal surface.

Spot welding connects heat transfer units to frames, eliminating adhesive materials and resolving manufacturing tolerance issues.

Removing the metal bottom block allows closer heat pipe packing and eliminates complex electroplating processes.

A dual-sided heat pipe cools a CPU and GPU simultaneously through opposite surfaces.

Undulating passages in a sealed heat mat increase surface area, resolving leakage risks while maintaining isothermal conditions.

A monolithic micro heat pipe integrates hierarchical micro and nanostructures to expand surface area for superior thermal management.

Segmented board bodies allow a heat spreader to bend around heat sources while preserving capillary integrity and reducing manufacturing complexity.

A cooling drum with perforated side flanges immerses in a heat transfer liquid tank to cool synthetic material films.

A liquid-cooled heat sink assembly uses a recessed metal base within a polymer manifold to define a coolant compartment for efficient thermal transfer.

Argon purging displaces air in the filling pipe, preventing alkali metal explosions during high-temperature heat pipe manufacturing.

A modular heat exchanger integrates alternative connection elements to a common interface for versatile vehicle cooling system configurations.

A flat heat pipe uses a capillary structure with thinner central and thicker edge portions to maximize vapor channel space.

Sensors detect precipitation and temperature to trigger heating elements, removing snow accumulation without manual intervention.

Concave bottomed holes in a loop heat pipe porous body eliminate stacking alignment errors and reduce vapor back-streaming.

Temperature-sensitive thermal expansion valves regulate working fluid flow to maintain autonomous temperature control within a defined range.

Ultrasonic oscillators atomize working fluid in a vapor chamber to direct heat flux reversibly, eliminating reliance on gravity for reliable operation.

A thermal transfer apparatus integrates heat pipes with rack rails for direct cold plate coupling.

Optimized internal ridges in aluminum tubes enhance heat transfer while maintaining expansion integrity and minimizing material deformation.

Gradient wetting structure accelerates working fluid reflux in flat heat pipes, reducing thermal resistance caused by porous wicks.

A two-phase heat transfer loop uses a remote compensation chamber and controller to manage vapor parasitic heat leaks.

A fiber layer sits below supporters in a vapor chamber to maintain structural integrity while preserving internal volume.