Satellite Evaporator Loop for Multi-Processor Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat transfer systems for cooling multiple processors or electronic components face challenges with non-homogeneous thermal loads, startup issues, and operational instabilities, particularly when using multiple evaporators in series or parallel configurations, which lead to increased pressure losses and limited performance.
Innovation Solution
A heat transfer system with a main fluid loop devoid of mechanical, gravitational, or capillary pumping means, featuring evaporator units arranged in bypass with ejection nozzles injecting vapor into the loop to create a driving force for forced circulation, allowing for flexible cooling of multiple processors and minimizing pressure losses through phase separation and vapor injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple evaporators are placed in parallel on a two-phase loop, then multiple processors can be cooled simultaneously, but pressure losses in the loop increase without increasing the driving effect
Solution Approach 1:
The system divides the cooling function into independent evaporator units that can be selectively activated. Each evaporator unit includes an evaporator, inlet pipe, and outlet pipe with ejection nozzle, allowing individual control and optimization for different thermal loads without requiring all units to operate simultaneously, thus reducing overall pressure losses.
Solution Approach 2:
The patent changes the phase parameter of the working fluid by injecting vapor directly into the main circuit through ejection nozzles. This vapor injection creates a driving effect that compensates for pressure losses, allowing multiple evaporators to operate in parallel without the penalty of increased pressure drops that would normally limit system performance.
2Adaptability or versatility
If two evaporators and two condensers are arranged in series for two processors, then thermal loads can be handled, but startup problems and operational instabilities occur
Solution Approach 1:
The system segments the cooling circuit into independent evaporator units with individual inlet and outlet pipes. This segmentation allows each unit to be controlled independently and simplifies the overall system architecture, eliminating the startup and stability problems associated with series arrangements of multiple evaporators and condensers.
Solution Approach 2:
The patent introduces vapor ejection nozzles as intermediaries that inject vapor into the main circuit. This vapor injection acts as a mediator that provides a driving effect to maintain stable operation, preventing the instabilities that occur in series configurations where thermal loads are non-homogeneous.
3Reliability
If sub-cooled liquid is used to offset parasitic heat flux at the evaporator, then heat transfer reliability is improved, but condenser size must be increased
Solution Approach 1:
The patent utilizes phase transitions by injecting vapor directly into the main circuit through ejection nozzles. This vapor injection provides both the driving effect for fluid circulation and the necessary cooling, eliminating the need for sub-cooling and allowing the condenser to be sized appropriately for the actual thermal load rather than for compensating parasitic heat flux.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of multiple processors with reduced pressure losses and increased driving effect, maintaining system robustness and performance even under varying conditions, including acceleration and parasitic heat flux, without the need for sub-cooling, thus enhancing flexibility and reliability.
Implementation Method 1
an evaporator including a porous member with capillary pumping, coupled to a heat source to be cooled
Implementation Method 2
the injection of vapor from the outlet pipe into the main circuit has a driving effect by transfer of momentum. The jet of vapor forms a driving force in the loop main circuit
Implementation Method 3
the circulation of a two-phase fluid with an evaporator and a condenser, phase changes efficiently transporting heat from one point to another
Implementation Method 4
the circulation of working fluid in the loop is generated by a thermosiphon effect or by a porous wick providing capillary pumping
Data Source
AI summary
A heat transfer system includes a main circuit forming a fluid loop, the main circuit being devoid of mechanical or capillary pumping means, at least one evaporator unit arranged in bypass to the main circuit, and at least one cooling heat exchanger that includes a portion of the loop main circuit and a heat exchanger coupled to a heat sink, for dissipating thermal energy. The evaporator unit includes an inlet pipe collecting liquid fluid from the main loop, an evaporator including a porous member with capillary pumping coupled to a heat source to be cooled, and an outlet pipe having an ejection nozzle with injects the fluid in primarily vapor phase into the main circuit at least in the loop direction of flow.