Heat Pipe Thermal Transfer with Integral Rack Rails
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Solution Overview
Problem
The increasing heat density in stacked electronic circuits due to space constraints and inefficient thermal cooling systems poses a risk of component failure, leading to data loss and high restorative costs.
Innovation Solution
A compact thermal transfer apparatus comprising an evaporator, heat pipes, a cold plate, and a condenser thermally coupled with external coolant supply, designed for efficient heat evacuation from electronic components, featuring removable cold plates and a rack-tray mechanism for easy installation and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat pipes and evaporators are used for thermal cooling, then heat evacuation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates the evaporator and condenser into a single unified thermal transfer apparatus that couples directly to the heat pipes. This merging eliminates the need for separate external cooling systems and complex pump mechanisms, while maintaining effective heat evacuation from stacked electronic circuits through the phase change cycle of the working fluid within the integrated structure.
Solution Approach 2:
The thermal transfer apparatus serves multiple functions simultaneously: the evaporator absorbs heat from the heat pipes, the working fluid undergoes phase change to transfer thermal energy, and the condenser dissipates the heat to the surrounding environment. This multi-functional integration simplifies the overall cooling system while improving heat evacuation efficiency across different operational conditions.
2Productivity
If stacked circuits are used to increase processing speed, then productivity is improved, but heat density increases causing reliability issues
Solution Approach 1:
The cooling system is segmented into distinct functional components (evaporator, heat pipes, condenser) that are strategically positioned to address heat generation at multiple locations within the stacked circuits. Each segment handles thermal management for specific circuit layers, preventing heat accumulation and maintaining component reliability while supporting high-density stacking for improved processing speed.
Solution Approach 2:
The working fluid acts as an intermediary medium that facilitates heat transfer from the electronic circuits through the evaporator and heat pipes to the condenser. This intermediary enables efficient thermal energy transport across the stacked circuit architecture, allowing high processing speeds to be maintained without compromising reliability due to excessive heat density.
3Volume of moving object
If compact thermal transfer apparatus is used, then space constraints are resolved, but ease of maintenance deteriorates
Solution Approach 1:
The compact thermal transfer apparatus is divided into modular segments (evaporator section, heat pipe connections, condenser section) that can be independently accessed and maintained. This segmentation allows technicians to service specific components without disassembling the entire compact structure, thereby maintaining ease of maintenance while achieving space-efficient integration.
Solution Approach 2:
The apparatus is designed with pre-configured access points and serviceable connections that anticipate maintenance requirements. The evaporator and condenser are positioned and connected in a way that facilitates routine inspection and repair activities before failures occur, ensuring that the compact design does not compromise maintainability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents coolant leakage, allows for compact and efficient heat evacuation from stacked circuits, and enables easy maintenance without disconnection of components, ensuring reliable operation and reduced restorative costs.
Implementation Method 1
an evaporator disposed over a heat-producing electronic component and thermally coupled to the heat-producing electronic component
Implementation Method 2
evaporates a working fluid inside the heat pipes
Implementation Method 3
The fluid is conveyed to a condenser comprising a heat exchanger cooled by a plurality of fins that condenses the fluid back to liquid form
Implementation Method 4
a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator
Implementation Method 5
a condenser thermally coupled to a second end of the heat pipes... that condenses the fluid back to liquid form
Implementation Method 6
a condenser comprising a heat exchanger cooled by a plurality of fins
Implementation Method 7
A pump and a heat sink are usually provided to supply a cooling liquid to the evaporator plate and dissipate the heat absorbed therein
Data Source
AI summary
A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.