Heat Dissipation Device Spot Welding Assembly Method
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Solution Overview
Problem
Current heat dissipation devices for mobile devices are costly and complex to manufacture, with issues of assembling tolerance and limited compatibility due to the use of adhesives and soldering, and are not adaptable to non-C-shaped or non-deformable heat transfer members.
Innovation Solution
A method involving a heat transfer unit with a chamber and wick structure, filled with a working fluid, is spot welded to a frame, reducing assembly steps and costs, and avoiding tolerance issues, while allowing compatibility with various heat transfer units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive agent or adhesive tape is used to connect heat transfer element to frame, then connection is achieved, but additional manufacturing cost is incurred
Solution Approach 1:
The patent removes the adhesive agent or adhesive tape from the connection process between the heat transfer element and the frame. Instead of using adhesive materials, the invention employs a mechanical pressing structure where the pressing member directly presses the heat transfer element against the frame, eliminating the need for additional adhesive substances and their associated manufacturing costs.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical pressing system. The pressing member applies mechanical force to secure the heat transfer element to the frame through direct contact and friction, substituting the chemical adhesive bonding process with a purely mechanical connection method.
2Strength
If soldering is used to connect heat transfer element to frame, then fixed connection is achieved, but high temperature causes position shift and increased accumulated tolerance
Solution Approach 1:
The patent changes the temperature parameter from high temperature (soldering) to low or room temperature (mechanical pressing). By operating at lower temperatures, the heat transfer element and frame materials do not undergo thermal expansion or softening that would cause position shifts, thereby maintaining manufacturing precision while achieving strong mechanical connection.
Solution Approach 2:
The patent replaces the thermal bonding process (soldering) with a mechanical pressing system. Instead of using heat to melt solder and create joints, the invention uses mechanical force from the pressing member to secure the components, eliminating the harmful thermal effects that cause position shifts and tolerance accumulation.
3Reliability
If C-shaped groove processing and press-fitting are used to install heat pipe, then heat pipe is securely clamped, but manufacturing cost increases and compatibility is limited
Solution Approach 1:
The patent creates a universal pressing mechanism that can accommodate various shapes and types of heat transfer elements (heat pipes, vapor chambers, heat spreaders, etc.) without requiring specific groove configurations. The pressing member applies force through a pressing surface that can adapt to different component geometries, making the system universally applicable to multiple heat transfer member types.
Solution Approach 2:
The patent removes the C-shaped groove structure from the manufacturing process. Instead of processing grooves into the heat transfer plate and press-fitting heat pipes into these grooves, the invention uses a separate pressing member that applies force directly to the heat transfer element surface, eliminating the need for complex groove machining operations.
4Ease of manufacture
If heat transfer element and frame are heated during soldering, then solder melts and flows into junction, but components tend to shift relative to each other
Solution Approach 1:
The patent changes the temperature parameter from high temperature (soldering requires melting point temperatures) to low or room temperature (mechanical pressing). This parameter change prevents thermal expansion and material softening that cause position shifts, while still achieving secure connection through mechanical force.
Solution Approach 2:
The patent positions the heat transfer element and frame in their final desired configuration before applying the pressing force. The pressing member is then activated to secure the components in this pre-positioned state, ensuring accurate relative positioning from the beginning rather than requiring post-soldering alignment corrections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and enhances compatibility with different heat transfer units, effectively addressing the challenges of assembling tolerance and manufacturing complexity.
Implementation Method 1
at least one heat transfer unit, which internally defines a chamber having at least one wick structure and a working fluid provided therein
Implementation Method 2
at least one wick structure and a working fluid provided therein
Implementation Method 3
spot welding the heat transfer unit to the frame at a junction formed therebetween
Data Source
AI summary
A method of manufacturing heat dissipation device includes the steps of providing at least one heat transfer unit; further providing at least one frame for connecting to the at least one heat transfer unit; and spot welding the heat transfer unit to the frame at a junction formed therebetween, so that the heat transfer unit is fixedly attached to the frame. With the above method, the steps for assembling the heat transfer unit to the frame are effectively reduced, and the material and production costs for applying adhesive agent or adhesive tape are also saved.