Oscillating Heat Pipe Panel for Isothermal Thermal Management
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Solution Overview
Problem
Radiator panels with low thermal conductivity hinder efficient heat rejection from heat sources located on one side to heat rejection devices on the other side, resulting in thermal gradients and non-uniform heat removal.
Innovation Solution
The implementation of oscillating heat pipe panels with a chassis and OHP plates that absorb heat from a heat source, spread it evenly across the panel, and reject it to a heat sink, ensuring an isothermal heat rejection surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If constant conductance heat pipes (CCHPs) are embedded in a lightweight honeycomb core to construct large scale radiator panels, then mass and structural requirements are met, but thermal conductance through the panel between CCHPs and across panel surfaces is low
Solution Approach 1:
The patent introduces an oscillating heat pipe (OHP) as an intermediary device between the heat source and the heat rejection surface. The OHP contains a working fluid that oscillates between liquid and vapor phases, actively transporting heat across the panel thickness. This mediator overcomes the low thermal conductance of the honeycomb core and CCHP system, enabling efficient heat transfer from interior heat sources to exterior rejection surfaces while maintaining the lightweight structural design.
2Weight of stationary object
If lightweight honeycomb material is used for radiator panels, then mass requirements are met, but through-panel thermal conductivity is poor
Solution Approach 1:
The oscillating heat pipe utilizes two-phase fluid dynamics (pneumatics/hydraulics) to transport heat through the lightweight honeycomb structure. The working fluid inside the OHP undergoes phase changes and oscillatory flow, creating an active thermal transport mechanism that bypasses the limitations of passive thermal conduction through the honeycomb material. This allows the panel to remain lightweight while achieving high effective thermal conductivity.
3Device complexity
If heat sources are located on the interior side of the panel, then structural integration is improved, but thermal coupling to heat rejection devices on the exterior side is difficult
Solution Approach 1:
The oscillating heat pipe extends in the thickness dimension of the panel, creating a thermal transport pathway that spans from the interior heat source location to the exterior rejection surface. By utilizing the third dimension (panel thickness) rather than relying on in-plane conduction, the OHP effectively couples heat sources on one side to heat rejection devices on the other side, overcoming the thermal coupling difficulty while maintaining structural integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution efficiently and uniformly removes heat from heat sources, minimizing temperature gradients and enhancing heat rejection efficiency across large or small panels.
Implementation Method 1
Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink
Implementation Method 2
at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels
Implementation Method 3
Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate
Data Source
AI summary
A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.