Dual-Sided IMU Sensor Layout for Compact, Accurate Measurement

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Solution Overview

Problem

Existing inertial measuring apparatuses face challenges in improving measurement accuracy while reducing their size.

Innovation Solution

A sensor apparatus with IMU sensors arranged on both surfaces of a substrate, where the sensors on one surface correspond to those on the opposite surface, balancing thermal stresses and reducing substrate deformation, thereby enhancing measurement accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If IMU sensors are arranged on both surfaces of the substrate, then measurement accuracy is improved and substrate deformation due to heat is suppressed, but device complexity increases

Engineering Contradiction:
Improvemeasurement accuracyVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies dimensionality change by arranging IMU sensors on both the front surface and back surface of the substrate, transitioning from a single-sided (2D) arrangement to a dual-sided (3D spatial utilization) arrangement. This allows sensors to be positioned at corresponding locations on opposite surfaces, enabling thermal stress cancellation and improved measurement accuracy without significantly increasing the device's footprint area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements the counterweight principle by placing IMU sensors at corresponding positions on both surfaces of the substrate. The sensors on opposite surfaces experience equal and opposite thermal stresses, which cancel each other out, preventing substrate deformation and maintaining measurement accuracy. This symmetric arrangement creates a balanced structure that neutralizes thermal effects.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

2Volume of moving object

If the size of the apparatus is reduced, then compactness is improved, but measurement accuracy deteriorates

Engineering Contradiction:
Improveapparatus sizeVSAvoidmeasurement accuracy
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent utilizes the third dimension (depth/thickness) by arranging sensors on both surfaces of the substrate, allowing compact integration of multiple sensors within a small footprint. This vertical stacking and dual-sided arrangement enables the apparatus to maintain small volume while achieving high measurement accuracy through the combined output of multiple sensors.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent merges the functionality of multiple IMU sensors into a single compact apparatus by integrating them on both surfaces of a common substrate. The sensors work together as a unified system, with their combined measurements providing high accuracy inertial data while maintaining a compact form factor suitable for portable applications.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12436170B2Sensor apparatus
Publication Date: 2025.10.07 SONY GROUP CORP
  • US12436170B2 patent drawing
  • US12436170B2 patent drawing
  • US12436170B2 patent drawing

AI summary

Provided is a sensor apparatus that includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. By arranging the IMU sensors on both the first surface and the second surface, it is possible to reduce the size of the apparatus and to suppress a deformation of the substrate due to heat. This makes it possible to realize a highly accurate measurement based on a detection result (sensing result) of a plurality of IMU sensors.