Dual-Sided LED Substrate Heat Dissipation and Wireless Control
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Solution Overview
Problem
Existing LED technologies face challenges in heat dissipation, appearance, and robustness when attempting to replace traditional filament light bulbs, particularly for decorative purposes, requiring a cost-effective solution that addresses these issues.
Innovation Solution
A lighting apparatus comprising a light module with dual LED chip layers, a driver for power conversion, and a wireless circuit for control, featuring a flexible substrate, interchangeable wireless modules, and adjustable LED chip configurations to enhance flexibility and functionality, allowing for various lighting effects and easy user customization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED technology is applied to replace filament light bulbs, then luminous efficacy is improved, but heat dissipation problems arise
Solution Approach 1:
The patent divides the light source into multiple LED chips arranged in a matrix array on both sides of a substrate, rather than using a single concentrated light source. This segmentation distributes the heat generation across multiple smaller units, improving heat dissipation while maintaining high luminous efficacy through the collective output of all LED chips.
Solution Approach 2:
The patent transitions from traditional single-sided LED mounting to dual-sided LED chip mounting on the substrate. By utilizing both sides of the substrate for mounting LED chips, the design increases the surface area for light emission and heat dissipation, effectively managing thermal load while enhancing luminous output in multiple directions.
2Use of energy by moving object
If LED technology is applied to replace filament light bulbs, then energy efficiency is improved, but appearance and robustness issues occur
Solution Approach 1:
The patent designs a multifunctional substrate that simultaneously serves as a mounting platform for LED chips, a heat dissipation structure, and a structural support element. The substrate integrates multiple functions including electrical connection, mechanical support, and thermal management, thereby improving robustness while maintaining energy efficiency.
Solution Approach 2:
The patent employs a composite structure combining the substrate material with LED chip arrays and associated electronic components. This composite design creates a robust integrated unit that maintains structural integrity and appearance while delivering efficient LED performance, addressing both aesthetic and durability concerns.
3Adaptability or versatility
If dual LED chip layers are mounted on both sides of the substrate, then lighting versatility is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple LED chip layers on both sides of the substrate into a single integrated light module assembly. By merging the dual-sided LED arrays, driving circuits, and heat dissipation structures into one unified module, the design achieves lighting versatility through multiple emission surfaces while simplifying installation and reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and flexible LED lighting system that effectively addresses heat dissipation, appearance, and robustness concerns, enabling versatile lighting applications while maintaining high luminous efficacy and user-friendly customization options.
Implementation Method 1
The first LED chip layer includes multiple LED chips and the second LED chip includes multiple LED chips
Implementation Method 2
LED (Light Emitted Diode) components of the first LED chip layer and the second LED chip layer
Data Source
AI summary
A lighting apparatus includes a light module, a driver and a wireless circuit. The light module includes an elongated substrate, a first LED chip layer mounted on a first side of the substrate and a second LED chip layer mounted on a second side of the substrate, and two electrodes on two opposite ends of the substrate. The wireless circuit is used for receiving an external command from an external device to control the driver to adjust the driving power of the light module to mix lights of different optical parameters. The driver has a plugging socket for plugging the wireless circuit.