Dual-Sided PCB Module for High-Connectivity ICs
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Solution Overview
Problem
Integrated circuits face limitations in connectivity due to the restricted surface area for electrical interfaces, which hinders the ability to interface effectively with other electronic components, especially as circuit complexity and performance increase.
Innovation Solution
The implementation of a dual-sided electrical interface for integrated circuits, where one group of electrical contacts is on the top surface and another on the bottom, allowing the circuit to be sandwiched between upper and lower printed circuit boards (PCBs) with sockets and stiffeners for enhanced connectivity and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If all electrical contacts are located on a single surface of the integrated circuit, then the device complexity is reduced, but the connectivity is limited due to restricted surface area
Solution Approach 1:
The patent transitions from a single-surface contact configuration to a dual-sided contact configuration, utilizing both the top and bottom surfaces of the integrated circuit package. This dimensional change allows electrical contacts to be distributed across two surfaces, effectively doubling the available connectivity interfaces without increasing the footprint area, thereby resolving the contradiction between connectivity and device complexity
2Adaptability or versatility
If the integrated circuit is positioned to maximize connectivity, then the connectivity is improved, but the structural support and heat dissipation are compromised
Solution Approach 1:
The patent segments the support structure into multiple functional components: upper and lower sockets for electrical connectivity, and upper and lower stiffeners for structural support. This segmentation allows each component to perform its specialized function optimally - sockets provide electrical interfaces while stiffeners provide mechanical rigidity - thereby resolving the contradiction between connectivity and structural support
3Adaptability or versatility
If the integrated circuit is positioned to maximize connectivity, then the connectivity is improved, but the heat dissipation is compromised
Solution Approach 1:
The patent segments the thermal management system into upper and lower heatsinks that can be positioned on opposite sides of the integrated circuit. This segmentation allows heat to be dissipated from both the top and bottom surfaces of the device, effectively doubling the heat dissipation capacity while maintaining the dual-sided contact configuration for maximum connectivity
Data Source
AI summary
A printed circuit board (PCB) module that includes a processor package, an upper PCB and a lower PCB. The processor package includes a processor substrate and a processor. An upper socket is disposed on a lower surface of the upper PCB, and the upper socket electrically connects to a top electrical interface on the upper surface of the processor substrate. The lower PCB electrically interfaces with a bottom electrical interface on a lower surface of the processor substrate.