Dual-Sided Power-Module Cooling Assembly for Even Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional heat dissipation assemblies for stacked inverters with single-sided cooling channels occupy excessive space and hinder efficient heat dissipation for dual elongated power modules.

Innovation Solution

A power-module-heat-dissipation assembly with two separated coolant flow channels, one for each power module stack, thermally coupled and in fluid communication, allowing coolant flow perpendicular to the module arrangement, facilitating quick and even heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-sided cooling channel is used in the heat dissipation assembly, then the structure is simple, but the space occupation is excessive and heat dissipation efficiency is reduced

Engineering Contradiction:

Improvecooling channel structureVSAvoidspace occupation

Core Design Contradiction:

Device complexityVSVolume of moving object

Solution Approach 1:

The patent transitions from a single-sided cooling channel design to a dual-sided cooling channel configuration. The first cooling channel is formed in the first housing base and the second cooling channel is formed in the second housing base, utilizing both upper and lower surfaces of the heat dissipation assembly. This dimensional expansion allows coolant to flow through both sides of the power modules, effectively doubling the heat dissipation surface area and reducing the overall space required for the cooling system.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a single-sided cooling channel is used, then the manufacturing process is simple, but the heat dissipation efficiency for dual power modules is insufficient

Engineering Contradiction:

Improvecooling channel fabricationVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The cooling system is segmented into two independent cooling channels: the first cooling channel in the first housing base and the second cooling channel in the second housing base. Each cooling channel is independently formed and can be manufactured separately, maintaining manufacturing simplicity while providing dedicated cooling paths for different sections of the dual power modules. This segmentation allows for optimized heat dissipation in each zone without complicating the overall manufacturing process.

Inventive Principle:

Principle #1Segmentation

3Ease of operation

If the coolant flow channel extends along the elongated direction of power modules, then the flow path is straightforward, but the channel length increases and heat dissipation performance deteriorates

Engineering Contradiction:

Improvecoolant flow pathVSAvoidflow channel length

Core Design Contradiction:

Ease of operationVSLength of stationary object

Solution Approach 1:

Instead of extending the cooling channels along the elongated direction of the power modules (lengthwise), the patent inverts the approach by forming the first cooling channel in the first housing base and the second cooling channel in the second housing base, with coolant flowing perpendicular to the module arrangement. This inverted configuration shortens the flow path length while maintaining effective heat dissipation across all modules through the dual-sided cooling approach.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation efficiency by reducing channel length and ensuring uniform heat dissipation across power modules, optimizing space utilization in stacked inverters.

Implementation Method 1

the first chamber is corresponding to an outer surface of the first housing base to form the first heat dissipation surface... the second chamber is corresponding to an outer surface of the second housing base to form the second heat dissipation surface

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first flow channel is a hollow structure of the first housing base and includes a first flow-channel front port, a first chamber and a first flow-channel rear port, the first chamber is in fluid communication with the first flow-channel front port and the first flow-channel rear port

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS12453063B2Power-module-heat-dissipation assembly

Publication Date: 2025.10.21 DELTA ELECTRONICS INC(CN)

AI summary

A power-module-heat-dissipation assembly is disclosed and includes plural first power modules, plural second power modules, a cooling-flow-channel inlet, a cooling-flow-channel outlet, a first housing base and a second housing base. The first housing base including a first flow channel and a first heat dissipation surface, and the second housing base including a second flow channel and a second heat dissipation surface are assembled to form a housing extended along a first direction. The first heat dissipation surface and the second heat dissipation surface are disposed on two opposite sides of the housing. The first and second power modules are arranged along the first direction and disposed on the first and second heat dissipation surfaces. The first and second flow channel are in fluid communication between the coolant flow-channel inlet and the cooling-flow-channel outlet, so as to dissipate the heat generated from the first and second power modules quickly and evenly.