Dual Stage Modular Optical Device With Insert Diagnostics
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Solution Overview
Problem
Conventional optical transceivers are too large and complex to be integrated into compact devices like laptops, requiring external connections that increase cost and vulnerability to damage, and occupy excessive board space on host bus adapters.
Innovation Solution
Dual stage modular optical devices with insert digital diagnostics components, featuring leadframe connections and component inserts that allow for compact integration and reduced size, enabling internal integration within small form factor devices while maintaining diagnostic functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional optical transceivers are used with external connections, then reliability is improved, but device complexity and vulnerability increase
Solution Approach 1:
The patent integrates the optical transceiver components (TOSA, ROSA, and digital diagnostics) into a single compact module that can be internally mounted within the small form factor device. This merging eliminates the need for external connections and separate housing, thereby reducing system complexity and vulnerability while maintaining reliability through unified internal integration.
2Adaptability or versatility
If conventional optical transceivers are used, then operational functionality is maintained, but device size and board space occupation increase
Solution Approach 1:
The optical transceiver is divided into distinct functional segments (TOSA package, ROSA package, and digital diagnostics package) that are independently fabricated and then integrated into a compact modular assembly. This segmentation allows each component to be optimized for minimal size while maintaining its operational functionality, enabling the overall device to fit within small form factor constraints.
Solution Approach 2:
The patent employs a nested packaging structure where the TOSA and ROSA are housed in separate fabricated packages that are vertically stacked and interconnected through leadframes. The digital diagnostics package is integrated into the same vertical space, creating a compact nested arrangement that minimizes the overall device volume while preserving all operational functions.
3Ease of operation
If conventional optical transceivers are used, then diagnostic functionality is provided, but cost and manufacturing complexity increase
Solution Approach 1:
The digital diagnostics package is designed as a universal module that can be integrated with both TOSA and ROSA configurations. The diagnostics circuitry uses standard electrical connections through the leadframe structure, allowing the same diagnostic functionality to be manufactured across different device variants without requiring separate diagnostic solutions, thereby reducing manufacturing cost and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reduced cost, compact, and integrated optical transceivers that fit within small envelopes, reducing system complexity and vulnerability, while maintaining compliance with operational standards and supporting digital diagnostics functions.
Implementation Method 1
A first fabricated package includes at least one of a light source for generating optical signals
Implementation Method 2
a light detector for detecting received optical signals
Data Source
AI summary
Embodiments of the present invention are directed to dual stage modular optical devices with insert digital diagnostics components. A first portion of a leadframe couples a first fabricated package including a light source and/or light detector to a second fabricated package with first opening for receiving inserts. A second portion of the leadframe couples the second fabricated package to a third fabricated package with a second opening for receiving inserts. A first component insert is coupled to the second fabricated package such that components of the first component insert can electrically interoperate with the light source and/or light detector. A second component insert is coupled to the third fabricated package such that components of the second component insert can electrically interoperate with components of the first component insert to implement digital diagnostics functions.


