Dual-Substrate Capacitive Touch Panel for Higher Yield Fabrication

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional capacitive touch panels face low production yield due to scratching or staining of the upper touch sensitive layer during fabrication of the lower touch sensitive layer, limiting their application to large-size panels and increasing damage risk.

Innovation Solution

The capacitive touch panel design includes a first glass substrate with a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, and a flexible circuit board, allowing for separate fabrication processes for the lower and upper touch sensitive layers, using insulation ink and conductive layers to protect the components and enhance yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the upper touch sensitive layer is formed first on the first glass substrate, then the lower touch sensitive layer can be formed subsequently, but the completed upper touch sensitive layer is easily scratched or stained during fabrication of the lower touch sensitive layer, significantly lowering production yield

Engineering Contradiction:
Improveseparate fabrication processVSAvoidproduction yield
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention divides the touch panel into two separate substrates: a first glass substrate for the upper touch sensitive layer and a second glass substrate for the lower touch sensitive layer. This segmentation allows each layer to be fabricated independently on separate substrates, eliminating the risk of scratching or staining the upper layer during lower layer fabrication, while still enabling separate fabrication processes for each layer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces a flexible circuit board as an intermediary component that electrically connects the upper and lower touch sensitive layers. The flexible circuit board is mounted on the first glass substrate and electrically connected to the upper touch sensitive layer, while also connecting to the lower touch sensitive layer on the second glass substrate, enabling electrical connection without direct contact between the fragile touch sensitive layers during fabrication.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If the upper touch sensitive layer is formed first, then the lower touch sensitive layer can be formed subsequently, but the lower touch sensitive layer is exposed without protection and easily collided and damaged

Engineering Contradiction:
Improvesequential fabricationVSAvoiddamage to lower touch sensitive layer
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

By separating the upper and lower touch sensitive layers onto different glass substrates, the invention provides inherent physical protection to each layer. The second glass substrate serves as a protective carrier for the lower touch sensitive layer during fabrication and handling, preventing direct exposure and collision damage while still allowing sequential fabrication processes.

Inventive Principle:
Principle #1Segmentation

3Productivity

If conventional separate formation of upper and lower touch sensitive layers is used, then fabrication flexibility is maintained, but production yield is significantly lowered due to scratching and staining

Engineering Contradiction:
Improveproduction yieldVSAvoidmulti-layer structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The invention segments the touch panel into two independent glass substrates with separate fabrication processes. This segmentation resolves the contradiction by allowing each substrate to be manufactured independently with high yield, then assembled together. The multi-layer structure is managed through systematic segmentation rather than complex integration, maintaining fabrication flexibility while improving production yield.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention resolves the complexity issue by transitioning from a planar multi-layer structure on a single substrate to a three-dimensional stacked structure with two separate substrates. This dimensional change allows independent fabrication of each layer on optimized substrates, improving yield while managing complexity through vertical integration rather than horizontal complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8947398B2Dual-substrate capacitive touch panel
Publication Date: 2015.02.03 TRENDON TOUCH TECHNOLOGY CORPORATION
  • US8947398B2 patent drawing
  • US8947398B2 patent drawing
  • US8947398B2 patent drawing

AI summary

A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.