Dual-Surface Substrate Cleaning With Synchronized Pressing Forces
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Solution Overview
Problem
Existing substrate processing technologies face challenges in applying strong cleaning forces due to the bending of substrates when using brushes, making it difficult to effectively clean both surfaces simultaneously.
Innovation Solution
A substrate processing apparatus with a first and second cleaning body, each with a moving mechanism, and a controller that synchronizes their horizontal movement to apply equal pressing forces on both surfaces, allowing for simultaneous cleaning of both the upper and lower surfaces of a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a brush is used to clean the substrate surface, then cleaning force can be applied, but the substrate bends due to the pressing force, reducing cleaning effectiveness
Solution Approach 1:
The cleaning system is divided into two separate cleaning bodies: one for the upper surface and one for the lower surface. This segmentation allows independent application of cleaning forces on each surface, preventing substrate bending that would occur with single-sided brushing while maintaining effective cleaning force on each surface.
Solution Approach 2:
The cleaning operation transitions from single-sided to dual-sided cleaning by utilizing both the upper and lower surfaces of the substrate simultaneously. This dimensional expansion allows cleaning forces to be applied from opposite directions, canceling out bending effects while maintaining strong cleaning action on each surface.
2Manufacturing precision
If sequential cleaning of upper and lower surfaces is performed, then each surface can be cleaned thoroughly, but cleaning time is doubled
Solution Approach 1:
The cleaning operations for the upper surface and lower surface are merged into a single simultaneous process. Both cleaning bodies operate at the same time on their respective surfaces, reducing the total cleaning time to match that of cleaning a single surface while maintaining thorough cleaning quality on both surfaces.
Solution Approach 2:
The cleaning process achieves continuous useful action by having both cleaning bodies operate simultaneously without interruption. While one cleaning body cleans the upper surface, the other cleans the lower surface at the same time, eliminating the idle time that would occur during substrate flipping or repositioning in sequential methods.
3Force
If strong pressing force is applied by a single cleaning body, then cleaning effectiveness improves, but substrate deflection increases
Solution Approach 1:
The pressing force from the cleaning body on one surface is counterbalanced by an equal and opposite pressing force from the cleaning body on the other surface. This counterweight effect prevents substrate deflection and maintains substrate stability while allowing strong cleaning force to be applied to each surface.
Solution Approach 2:
The cleaning system uses asymmetric force application by having cleaning bodies press on opposite surfaces of the substrate. This asymmetric arrangement from opposite directions creates balanced forces that stabilize the substrate while maintaining effective cleaning pressure on each surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables strong and efficient cleaning of both surfaces of a substrate without deflecting it, overcoming the limitations of single-sided cleaning and reducing cleaning time compared to sequential surface cleaning methods.
Implementation Method 1
The first cleaning body cleans one surface of the substrate held by the substrate holder by ejecting fluid thereto
Implementation Method 2
The first cleaning body cleans one surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith
Data Source
AI summary
A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.