Dual-Use Modular Mid-Board Optics for High-Density Switch ASIC Integration
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Solution Overview
Problem
Current optical transceiver solutions for system devices are inefficient in terms of cost, electrical signal integrity, thermal management, PCB area utilization, faceplate area utilization, and optical cable management, and are inflexible due to the need for different configurations for various applications, limiting their integration with processing components like switch ASICs on system boards.
Innovation Solution
A universally-configurable system board design that supports both soldered-down and socketized MBO configurations with a dual-use MBO system, allowing for interchangeable MBO assemblies and interposer boards with VIPPO technology to enhance signal integrity and reduce design complexity, enabling flexible and high-density deployments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical transceivers are integrated into system devices, then communication speed and bandwidth are improved, but thermal management and electrical signal integrity deteriorate
Solution Approach 1:
The patent segments the optical transceiver system into separate modules: optical transceivers are mounted on removable line cards rather than being integrated into the main system device. This segmentation allows the heat-generating optical components to be physically separated from the main processing unit, improving thermal management while maintaining high communication speeds through dedicated optical pathways.
Solution Approach 2:
The patent introduces an intermediary optical interface layer between the system device and external communication networks. This intermediary layer handles optical signal conversion and thermal management separately, allowing the main system device to benefit from high-speed optical communication without directly承受 the thermal burden of optical transceiver operation.
2Quantity of substance
If optical transceivers are integrated into system devices, then communication bandwidth is improved, but electrical signal integrity deteriorates
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission for communication pathways. By substituting electrical signals with optical signals, the system achieves higher bandwidth while eliminating the electrical interference and signal integrity issues associated with traditional electrical transmission over long distances or through complex PCB traces.
3Adaptability or versatility
If different configurations are used for various applications, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent implements a universal line card architecture that can accommodate multiple types of optical transceivers and configurations through a standardized interface. The removable line card design with universal mounting and electrical interfaces allows a single base system to support various applications (different transceiver types, fiber configurations, data rates) without requiring multiple specialized system designs, thereby improving adaptability while controlling complexity.
4Adaptability or versatility
If faceplate area is utilized for optical transceivers, then integration is improved, but area utilization efficiency deteriorates
Solution Approach 1:
The patent moves optical transceiver mounting from the two-dimensional faceplate surface to a three-dimensional modular architecture where line cards with optical transceivers are inserted into slots on the system device. This dimensional change allows optical transceivers to be integrated into the system without consuming valuable faceplate real estate, as the line cards extend perpendicular to the faceplate surface and utilize vertical space rather than horizontal faceplate area.
Data Source
AI summary
A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.