Dual-Wavelength Laser Processing for Fast Piercing and Cutting

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Solution Overview

Problem

High-power laser systems face inefficiencies in materials processing due to varying material responses to different wavelengths and thicknesses, making it challenging to optimize laser systems for multiple materials and operations.

Innovation Solution

A dual-wavelength laser system is employed, where a shorter-wavelength laser is used for initial piercing and melting, and a longer-wavelength laser for cutting, allowing for efficient processing of various materials by leveraging their unique absorption properties and extending the lifespan of the secondary laser.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a shorter-wavelength laser is used for initial piercing and melting, then absorption by the material is improved, but the laser lifespan is reduced and ramp-up time increases

Engineering Contradiction:
Improvebeam absorptionVSAvoidlaser lifespan
Core Design Contradiction:
Use of energy by moving objectVSDuration of action of moving object

Solution Approach 1:

The shorter-wavelength laser is used temporarily only during the initial piercing and melting phase to create a hole in the material, after which the longer-wavelength laser takes over for the cutting phase. This preliminary action allows the shorter-wavelength laser to avoid prolonged operation, thereby extending its lifespan while still achieving high absorption during the critical initial stage.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If a shorter-wavelength laser is used for initial piercing, then processing speed is improved, but the laser cost increases

Engineering Contradiction:
Improvepiercing speedVSAvoidlaser cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The shorter-wavelength laser is deployed only for the brief initial piercing operation where its high absorption capability enables fast processing, then the system switches to the longer-wavelength laser for the more extended cutting operation. This time-limited use minimizes the operational requirements for the expensive shorter-wavelength laser while maintaining high productivity during the critical piercing phase.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If a longer-wavelength laser is used for cutting, then efficiency is improved, but initial piercing capability is reduced

Engineering Contradiction:
Improvecutting efficiencyVSAvoidpiercing quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system uses the shorter-wavelength laser to perform the preliminary piercing and melting action, creating a hole through which the longer-wavelength laser can then efficiently cut. This sequence ensures that the longer-wavelength laser operates only after the material has been pre-conditioned, allowing it to achieve high cutting efficiency without suffering from poor piercing capability.

Inventive Principle:
Principle #10Preliminary action

4Device complexity

If a single-wavelength laser system is used, then device complexity is reduced, but adaptability to different materials is limited

Engineering Contradiction:
Improvesystem complexityVSAvoidmaterial compatibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The dual-wavelength laser system is designed to handle multiple material types and processing requirements by switching between wavelengths: the shorter-wavelength laser addresses materials with high reflectivity at longer wavelengths (such as copper and aluminum), while the longer-wavelength laser provides efficient cutting for materials with good absorption at that wavelength. This multi-functionality allows a single system to adapt to diverse materials without requiring completely different laser systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances processing efficiency and quality by optimizing beam absorption and reducing damage from spurious reflections, enabling faster and more precise cutting and welding across different materials and thicknesses.

Implementation Method 1

During a first stage, at least a secondary laser beam is directed to a surface of the workpiece, whereby energy of the secondary laser beam is absorbed by the workpiece

Methodology Applied
Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 2

energy of the secondary laser beam is absorbed by the workpiece... after at least a portion of the surface of the workpiece reacts to absorption of energy

Methodology Applied
Scientific EffectPhotothermal conversion:

Implementation Method 3

During a second stage after at least a portion of the surface of the workpiece reacts to absorption of energy of the secondary laser beam, at least a primary laser beam is directed to the surface of the workpiece during relative movement therebetween, whereby the workpiece is cut or welded

Methodology Applied
Scientific EffectThermal processing:

Data Source

PatentUS20240109154A1Dual-wavelength laser systems and material processing utilizing such systems
Publication Date: 2024.04.04 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US20240109154A1 patent drawing
  • US20240109154A1 patent drawing
  • US20240109154A1 patent drawing

AI summary

In various embodiments, laser beams of two different wavelengths are utilized, sequentially and/or simultaneously, to process workpieces in various processing stages such as melting, piercing, cutting, and welding.