Welding/Soldering/Cutting Articles TRIZ Cases

Roll-to-roll laser shockwave forming creates ultrasmooth crystalline metal nanostructures at ambient conditions with high throughput.

A short-pitch laser annealing step flattens rough irradiation surfaces so internal modified layers can be formed accurately with fewer passes.

Joining a wrought outer splined plate to a sintered inner gear enables stronger, durable parts with tight tolerances at lower cost.

Beam spot vibration creates thick sheet metal marking lines in one pass, avoiding discoloration, long cycle time, and higher reflected light risk.

A transparent polymer backing keeps laser-cut metal foil stable for multi-pass cutting, debris control, and easier part separation.

Ablating the Al-Si coating before contour cutting keeps foreign phases out of weld seams while maintaining continuous blank production.

A silicon nitride or sialon probe helps friction stir weld thick steel plates with lower tool breakage, wear, and production cost.

Multiple laser wavelengths are diffracted onto one optical axis to keep annealing position stable while tuning polysilicon grain quality.

A ring-shaped Bessel-like laser profile creates through-glass cylindrical modifications that etch into precise microholes in thin glass.

Dynamic speed- and acceleration-based parameter conversion improves laser corner cutting quality while reducing gas use on varying contours.

Tailored ultrashort laser bursts adjust pulse amplitudes to cut semiconductor links cleanly while limiting over cratering and substrate damage.

Low-frequency CO2 laser pulses form non-overlapping score spots in recyclable polyolefin films, enabling easy tear without harming barrier properties.

Pulsed laser ablation at a non-normal angle forms oxidized microstructures on metal surfaces, boosting durable broadband emissivity.

Comparing thermal radiation and plasma light during laser welding reveals minute abnormalities more accurately and reduces false determinations.

A high-index rotatable ball and collimating lens keep focus distance stable while compressed air controls contact pressure for precise laser welding.

Varying break-point depth in metal-ceramic substrates improves transport stability, lowers rejects, and enables precise fracture control.

Stitch welding and hot die forming create diffusion-bonded stiffeners in dual-walled titanium tubing, cutting extra forming steps and preserving bond integrity.

A graded hollow common electrode layout cuts capacitance and equalizes RC loading, keeping LCD panel charging rates uniform.

Two-stage cooling in aluminum spot welding suppresses solidification cracking while shortening hot electrode contact to avoid adhesion.

Pulse-cluster laser ablation and HF etching enable large-scale 3D quartz microchannels with faster processing and smoother surfaces.

Controlled low-speed tool joining keeps welds below recrystallization temperature to preserve strength and hardness in steel and aluminum joints.

Grouped pulse timing forms wafer grooves while breaking growing debris after plasma fades, improving quality without extra processing steps.

A z-axis ball screw, inline spring, and feedback sensors enable precise bond force while minimizing impact in ultrasonic welding.

Pulse laser cutting with tuned beam size and duty factor limits dross and stress concentration at steel strip welded joints during cold rolling.

A fast second laser scan stirs the molten pool in aluminum lap welding, breaking bubbles to limit blow holes without slowing production.

Temporary etch openings enable long, uniform microchannels, then melt-seal with substrate material to form tight seams and preserve surface integrity.

A short-wavelength beam handles piercing and melting, then a longer-wavelength beam cuts more efficiently with less reflection damage.

Blue-violet laser welding joins thin non-ferrous strip edges into small hollow profiles with smooth seams and no internal post-processing.

Electronic excitation boosts resin absorption of longer-wavelength light, enabling efficient laser heating, joining, and shaping of common resins.

Adjustable pulsed laser focal planes form aligned ablation paths through bonded wafers, cutting debris, damage, and cooling-water needs.

An undercut recess with a pressed collar locks solder into a metal sheet, preventing loosening during transport, vibration, and further processing.

Discrete recess-formed holes hold laser-melted filler to join steel sheets while suppressing shrinkage deformation and gap management issues.

Switching laser polarization during wafer cutting improves back-side die strength and reduces stress defects without slowing throughput.

Laser modification, anisotropic etching, and a resistant capping layer create 3D glass recesses with overhangs for sensors and contacts.

A Ca, Mg, Zn, and Ni surface layer helps aluminum alloys resist corrosion while preserving strength, formability, and paint pretreatment compatibility.

Multiple annular beams create closely spaced focal points for accurate thin-material cutting without replacing diffractive optics.

Overlapping laser scan paths deepen lamination welds while limiting sputtering and blowholes, improving bond strength at faster speeds.

A blasted rough-surface cutter reshapes spot-welding electrode tips while breaking oxide film, stabilizing aluminum welding and extending dressing cycles.

A pulsed laser forms a metallic reaction layer on Al-Si coated steel, stabilizing weld seams while preventing scale formation and decarburization.

Laser ablation removes mill scale from tubular inner and outer surfaces while preserving base metal properties and reducing blasting waste.

Bond dissimilar metals at a temperature where both have similar strength to avoid brittle intermetallics and martensite at the joint.

Controlled weld-zone hardness helps a closed-section frame member prevent spot-weld fracture and preserve collision energy absorption.

X-ray imaging guides laser ablation to expose buried semiconductor defects faster than grinding or FIB, with less contamination and fewer artifacts.

Split and delayed laser pulses form SiC separation layers with less damage and waste, improving wafer yield and productivity.

A translating insert with thermal decoupling enables resistance welding between dissimilar parts while protecting the first part from heat.

In-line camera-recorded laser marks calibrate a moving sheet or web during cutting, preserving production continuity and mark accuracy.

Overlapped friction joining of copper-aluminum thin plates limits intermetallic growth and lowers electrical resistance.

Controlled oxidation gives the welded surface a high pitting potential, improving corrosion resistance without coatings or oxygen-free welding.

Controlled lateral aberration shapes the focused laser into a witch hat profile, reducing spatter while preserving deep, stable weld quality.

Two laser beams and inert gas polish aluminum alloy surfaces to prevent oxide film, reduce roughness, and limit polishing cracks.