Thin-Glass Microhole Etching with Ring-Shaped Laser Beam Shaping

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Solution Overview

Problem

Existing methods for creating microholes in transparent materials like glass struggle with precision and productivity, particularly in thin glass, due to limitations in beam shaping and etching processes, which affect the geometry and etchability of the modifications.

Innovation Solution

A laser processing system utilizing a diffractive optical beam shaping element and a combination of axicon and phase screw plate to generate a Bessel beam-like beam profile with an annular transverse intensity distribution, allowing for the creation of cylindrical microholes through selective laser etching, enabling precise control over hole diameter and aspect ratio.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional laser beam processing is used on thin glass, then the process is simple, but the manufacturing precision and productivity are insufficient

Engineering Contradiction:
Improvemicrohole diameter precisionVSAvoidbeam shaping system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A diffractive optical element is introduced as an intermediary component between the laser source and the glass substrate. This DOE shapes the laser beam into a Bessel beam profile, enabling precise microhole formation in thin glass without requiring complex mechanical or optical systems. The intermediary element transforms the conventional Gaussian beam into a structured light field that maintains its shape during propagation, achieving high precision while keeping the overall system relatively simple.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Length of moving object

If elongated focus distributions are used for glass modification, then the modification extends through the material, but the beam shape control becomes complex

Engineering Contradiction:
Improvemodification lengthVSAvoidoptical setup complexity
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical optical setups with a diffractive optical element that generates Bessel beams through optical diffraction principles. Instead of using multiple lenses, mirrors, and adjustment mechanisms to create elongated focus distributions, the DOE uses interference and diffraction of light to self-form a Bessel beam profile that naturally maintains its shape over an extended propagation distance, simplifying the optical system while achieving the desired elongated modification.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If wet-chemical etching is used after laser modification, then the etch rate can be controlled, but the overall processing time increases

Engineering Contradiction:
Improvemicrohole geometry precisionVSAvoidtotal processing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The laser processing step is designed to create a precise cylindrical modification pattern that serves as a pre-prepared template for the subsequent etching process. By using Bessel beam-induced modifications with controlled geometry and distribution, the preliminary laser action defines the exact microhole shape and position, allowing the wet-chemical etching to proceed efficiently with minimal additional time while maintaining high precision. The preliminary structured modification enables selective and rapid etching.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of microholes with high precision and productivity, achieving diameters as small as 5 μm to 200 μm, with improved etchability and surface quality, and allows for the formation of microholes in thin and ultra-thin glass without significant diffraction effects along the propagation direction.

Implementation Method 1

a diffractive optical beam shaping element disclosed herein, or a combination of an axicon for imprinting an axicon phase distribution and a phase screw plate for imprinting a vortex phase distribution

Methodology Applied
Scientific EffectDiffraction: Diffraction

Implementation Method 2

Volume absorption of the laser radiation can be used in transparent materials, for example, for drilling, separation by induced stress, welding, modifying the refractive properties, or selective laser etching

Methodology Applied
Scientific EffectVolume absorption: Absorption (EM radiation)

Implementation Method 3

introducing the workpiece with the modification into a wet-chemical etching bath for structural separation of the cylindrical body from the residual material

Methodology Applied
Scientific EffectChemical etching: Chemical Bonding

Data Source

PatentEP4041488B1Optical stamping of micro-holes into thin glass
Publication Date: 2024.05.15 TRUMPF LASER & SYSTEMTECHNIK SE
  • EP4041488B1 patent drawingFigure 1~2B
  • EP4041488B1 patent drawingFigure 2C
  • EP4041488B1 patent drawingFigure 2D

AI summary

For the selective laser-induced etching of a micro-hole (81) into a workpiece (75), a method comprises the following steps: producing (step 71) a modification (91) in the workpiece (75), said modification extending from an entrance side (61A) as far as an exit side (61B) of the workpiece, wherein the modification (91) is produced by a laser pulse having a ring-shaped transverse intensity distribution (51A, 51B, 151), which extends in a propagation direction (Z) of the laser beam (5) at least over a length (L) which results in a formation of the modification (91) from the entrance side (61A) as far as the exit side (61B) of the workpiece, wherein the modification (91) delimits a cylindrical body (77) from a remaining material (79) surrounding the modification (91), and introducing (step 73) the workpiece (75) having the modification (91) into a wet-chemical etching bath (80) for the purpose of structurally separating the cylindrical body (77) from the remaining material (79).