Glass Microstructures With Etched Overhangs and Contoured Capping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for producing microstructures in glass substrates are limited in creating complex, three-dimensional structures with arbitrary contours and topography, and do not effectively utilize the glass substrate's properties for applications like sensors and electrical contacts.
Innovation Solution
A method involving laser-induced modifications and anisotropic etching to create mutually opposing recesses, followed by applying a resistant cover layer on one surface, allowing further etching to create overhang structures that can be used as an etching resist and for material removal, enabling the production of glass substrates with arbitrary contours and topography suitable for complex electrical microstructures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If conventional etching methods are used to create microstructures in glass substrates, then simple recesses can be produced, but complex three-dimensional structures with overhangs and arbitrary contours cannot be achieved
Solution Approach 1:
The patent applies a cover layer to the glass substrate surface before etching. This preliminary action creates a protective mask that defines the desired microstructure pattern, enabling complex three-dimensional shapes with overhangs to be formed through subsequent selective etching processes without requiring complex manufacturing equipment
Solution Approach 2:
The cover layer acts as an intermediary between the etching process and the glass substrate. It protects specific areas from etching while allowing precise material removal in exposed regions, enabling the creation of complex microstructures that would otherwise be impossible to manufacture with conventional direct etching methods
2Productivity
If the entire glass substrate surface is utilized for microstructures, then manufacturing efficiency is improved, but electrical contacts and sensor applications are compromised
Solution Approach 1:
The patent creates microstructures with varying local properties by selectively applying the cover layer and etching process. Different regions of the glass substrate can have different microstructure densities, depths, and patterns, allowing areas optimized for manufacturing efficiency while preserving regions suitable for electrical contacts and sensor applications
3Length of stationary object
If deep recesses are created through the glass substrate, then through-holes and deep structures are achieved, but material removal and substrate thinning occur
Solution Approach 1:
The cover layer is applied beforehand to protect areas where material should be retained. During the etching process, this preliminary protective action ensures that deep recesses are created only in exposed regions, minimizing unnecessary material removal while achieving the required recess depths for through-holes and deep structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of glass substrates with overhang structures that serve as separating surfaces and can be used for electrical contacts, sensors, and other applications, with adjustable shape and size, and can reduce material thickness for optimal use in microsystem technology.
Implementation Method 1
modifications are first introduced into at least one outer surface by means of laser radiation and, due to the laser action during the modification, a chemical conversion of the substrate material occurs
Implementation Method 2
The laser's action results in no or only very minimal material removal from the substrate's surface. The laser energy input can thus be limited to a few pulses or a single pulse
Implementation Method 3
the microstructures are produced by an etching process by means of anisotropic material removal through a plurality of, in particular at least partially conical, recesses
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a method for producing microstructures in a glass substrate (1), wherein firstly laser modifications are introduced into the glass substrate (1) in both outer surfaces (2, 3). Etching the glass substrate (1) that has been treated in this way gives rise to a multiplicity of conical cutouts (5) in the glass substrate (1) on account of anisotropic material removal. As soon as the cutouts (5) of the desired size have been produced, the etching process is interrupted and a capping layer (6) that is resistant to the etching attack is applied to the upper, first outer surface (2), said capping layer thus matching the contour of the cutouts (5). Afterward, the glass substrate (1) that has been coated in this way is etched further, further material removal occurring in the cutout (5) at the second outer surface (3) facing away from the capping layer (6), while the first outer surface (2), which is protected by the capping layer (6) as etching resist, is maintained unchanged. The progressive material removal results in a deepening (T) of the cutout (5) until the latter has finally reached a rear side (7) of the capping layer (6), and the etching process is ended. As a result, the capping layer (6) bridging the cutouts (5) acquires, according to the invention, a three-dimensionally contoured constitution which is usable for diverse application purposes.