Metal-Ceramic Breaking Point Depth Modulation for Stable Fracture
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Solution Overview
Problem
Existing methods for creating predetermined breaking points in metal-ceramic substrates, particularly in master cards, often result in unintentional breaking and high reject rates due to inadequate depth modulation, leading to instability during transport.
Innovation Solution
A method involving the formation of predetermined breaking points with varying depths, where a first section and a second section have different depths, modulated along the direction of the breaking point, ensuring stability and precise fracture behavior, utilizing ultrashort pulse lasers and temperature treatment to prevent thermomechanical stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a predetermined breaking point is formed with uniform depth in metal-ceramic substrate, then the machining process is simple, but the substrate exhibits instability during transport and high reject rates due to unintentional breaking
Solution Approach 1:
The patent applies local quality by creating a depth-modulated breaking point structure where different sections have different depths. The first section has a first depth and the second section has a second depth that is greater than the first depth, creating localized variations in the breaking point structure that enhance stability during transport while maintaining controlled fracture behavior.
2Manufacturing precision
If the depth of predetermined breaking point is increased to ensure stable fracture, then fracture control improves, but thermomechanical stresses increase leading to unintended breaking
Solution Approach 1:
The patent resolves this contradiction by applying local quality through depth modulation. The first section maintains a smaller first depth that minimizes thermomechanical stresses, while the second section has a larger second depth that ensures stable fracture control. This localized differentiation allows each section to optimize for its specific function.
Solution Approach 2:
The patent applies segmentation by dividing the breaking point into multiple sections (first section and second section) with different depth characteristics. This segmentation allows the breaking point to exhibit different functional properties in different regions, combining stress minimization with fracture control.
3Productivity
If uniform depth is used throughout the breaking point, then the machining process is straightforward, but reject rates increase due to inadequate depth modulation
Solution Approach 1:
The patent applies local quality by implementing depth modulation where the first section has a first depth and the second section has a second depth greater than the first depth. This localized differentiation optimizes the breaking quality by creating appropriate stress distribution and fracture control in different sections, thereby reducing reject rates while maintaining production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the stability and reliability of metal-ceramic substrates during transport, reduces reject rates, and improves thermal shock resistance by ensuring flawless breaking and targeted weakening without unintended fractures.
Implementation Method 1
The use of ultrashort pulse lasers has proven advantageous here
Implementation Method 2
utilizing ultrashort pulse lasers and temperature treatment to prevent thermomechanical stresses
Data Source
AI summary
A method for machining a metal-ceramic substrate (1), in particular for producing a predetermined breaking point, comprising:providing a metal-ceramic substrate (1) andforming a predetermined breaking point (7) in the metal-ceramic substrate (1) wherein the predetermined breaking point (7) has along a direction (V) thereof at least a first portion (A1) having a first depth (T1) and at least a second portion (A2) having a second depth (T2), wherein a second depth (T2) is realized, which is different from the first depth (T1).