Dummy Pad Layout for Reliable Semiconductor Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in bonding processes of stacked semiconductor devices due to uneven expansion of pads, leading to defects and reduced manufacturing yield.
Innovation Solution
The use of dummy pads with specific shapes and dimensions between functional pads to minimize stress and expansion, reducing interference during bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If functional pads are placed close together to increase integration density, then manufacturing precision is improved, but stress and expansion during bonding increases causing defects
Solution Approach 1:
The pad structure is segmented into functional pads and dummy pads, where dummy pads are strategically placed between functional pads to compensate for stress and expansion during bonding, thereby maintaining both high integration density and bonding reliability
Solution Approach 2:
Dummy pads act as intermediary elements between functional pads, absorbing thermal expansion and mechanical stress to prevent defects during the bonding process, thus protecting the reliability of the overall pad structure
2Reliability
If dummy pads are added between functional pads to reduce stress, then bonding reliability is improved, but device complexity increases
Solution Approach 1:
Dummy pads are selectively placed only in specific locations where stress and expansion are most problematic, rather than uniformly across all pads, thus improving bonding reliability while minimizing the increase in device complexity
Data Source
AI summary
A semiconductor device and method of manufacture are presented in which a first pad and a second pad are formed adjacent to each other. A first set of dummy pads is manufactured between the first pad and the second pad and bonding pads are formed in electrical connection to the first pad and the second pad.