Dummy Pattern Heat Dissipation in Tiled Display Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in effectively dissipating heat generated during the cutting process, which can damage elements in the light exit area, and this can lead to inefficiencies in the manufacturing process due to the need for additional mask processes.
Innovation Solution
A display device is designed with a dummy pattern having a stack structure of conductive layers in the heat dissipation dummy area between the light exit area and the non-display area, creating a heat dissipation path and reducing damage from heat generated during the cutting process without requiring additional mask processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If heat dissipation dummy area is created between light exit area and non-display area, then heat-related damage to elements is reduced, but device structure becomes more complex
Solution Approach 1:
The patent extracts the heat dissipation function from the main display structure by creating a separate dummy pattern in the heat dissipation dummy area. This dummy pattern includes a first conductive layer and a second conductive layer that are spatially separated from the functional electrode layers, allowing heat dissipation without interfering with the display function. The dummy pattern is specifically positioned between the light exit area and non-display area to capture and dissipate heat before it reaches sensitive elements.
Solution Approach 2:
The dummy pattern acts as an intermediary heat dissipation structure between the light exit area (where heat is generated) and the non-display area. The first conductive layer and second conductive layer in the dummy pattern serve as intermediate heat conduction paths, transferring heat away from sensitive elements without requiring direct modification of the functional display structure. This intermediary structure protects elements while maintaining the integrity of the display area.
2Manufacturing precision
If additional mask processes are used to protect elements from heat, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The dummy pattern is formed in advance during the standard manufacturing process, before the cutting process occurs. The first conductive layer and second conductive layer are deposited and patterned as part of the normal fabrication sequence, creating the heat dissipation structure beforehand. This preliminary formation of the dummy pattern eliminates the need for additional protective mask processes during cutting, as the heat dissipation function is already in place to protect elements during subsequent manufacturing steps.
Solution Approach 2:
The dummy pattern serves multiple functions: it provides heat dissipation during cutting, maintains structural integrity of the substrate, and can be formed using the same conductive layer deposition processes used for functional electrodes. By making the dummy pattern universal with the existing manufacturing process (using identical conductive layer materials and deposition techniques), no additional specialized mask processes are required, thus maintaining productivity while achieving protective precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat-related damage to elements in the light exit area and maintains manufacturing efficiency by allowing heat dissipation through the conductive layers, preventing decreases in process efficiency.
Implementation Method 1
a dummy pattern having a stack structure made up of a plurality of conductive layers (or metal layers) is disposed in a heat dissipation dummy area located between a light exit area and a non-display area, to form a heat dissipation path
Data Source
AI summary
A display device and a tiled display are provided. The display device includes: a substrate having a display area and a non-display area which are defined thereon; a circuit element layer disposed on the substrate and including a conductive layer; an electrode layer disposed on the circuit element layer and including first and second electrodes spaced apart from each other; a light-emitting element disposed between the first electrode and the second electrode; and a dummy pattern disposed in a heat dissipation dummy area located at an edge of the display area. The dummy pattern includes a first layer and a second layer, the first layer is made of or includes a same material as the conductive layer of the circuit element layer, and the second layer is disposed above the first layer and in contact with at least a part of the first layer.