Flow-Enhanced Dummy Structure for Void-Free Sidewall Filling
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Solution Overview
Problem
The integration of passive components like capacitors, inductors, and resistors into the package substrate core results in shifting, rotation, and void formation due to thickness mismatches, leading to reliability issues and incomplete sidewall filling.
Innovation Solution
Employing a dummy structure with integrated fluidic paths that divert fill material horizontally to match the core thickness, using adhesive layers and vertical holes to ensure complete gap filling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are placed in deep cavities through the core, then space utilization is improved, but the components may shift or rotate during embedding
Solution Approach 1:
A dummy structure is introduced as an intermediary component between the passive component and the cavity walls. This dummy structure provides mechanical support and restraint, preventing the passive component from shifting or rotating during the embedding process while still allowing the component to be placed in the deep cavity for improved space utilization.
Solution Approach 2:
The dummy structure is prepared in advance with protrusions that extend into the cavity before the passive component is inserted. These pre-positioned protrusions create mechanical constraints that guide and stabilize the passive component during insertion, preventing shifting and rotation before the final embedding is complete.
2Area of stationary object
If passive components are placed in deep cavities through the core, then space utilization is improved, but filling the small gaps between sidewalls is difficult
Solution Approach 1:
The dummy structure acts as a mediator that creates a stepped configuration with the passive component. This configuration reduces the aspect ratio of the gaps by creating intermediate filling zones, making it easier to completely fill the sidewall gaps with embedding material and eliminate voids.
Solution Approach 2:
The embedding space is segmented into multiple zones by the dummy structure and passive component arrangement. This segmentation divides the difficult-to-fill high aspect ratio gap into smaller, more manageable filling zones, improving manufacturing precision and ensuring complete sidewall filling.
3Area of stationary object
If passive components are placed in deep cavities through the core, then space utilization is improved, but voids may be present leading to reliability issues
Solution Approach 1:
The dummy structure serves as a mediator that prevents void formation by creating a stepped embedding configuration. This configuration ensures that embedding material can flow and fill all gaps completely, eliminating voids that would otherwise form in deep cavities while maintaining improved space utilization.
Solution Approach 2:
The dummy structure is prepared in advance to create mechanical constraints and guide the embedding material flow. This preliminary action ensures that the embedding material fills all spaces completely before the component is fully embedded, preventing void formation that would compromise reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents void formation and enhances the reliability of the package substrate by ensuring uniform thickness and effective filling of high aspect ratio gaps.
Implementation Method 1
a fluidic path is provided within the dummy structure. The fluidic path may fluidically couple a top of the dummy structure to a sidewall of the dummy structure
Implementation Method 2
an adhesive layer is provided between the passive component and the dummy structure
Implementation Method 3
Flow enhanced dummy structure to enable capillary flow based sidewall filling
Data Source
AI summary
Embodiments disclosed herein include an apparatus with a component embedded in a core. Apparatuses disclosed herein may comprise a first component with a first surface and a second surface opposite from the first surface, where a pad is provided on the first surface. In an embodiment, a layer is over the second surface of the first component, and a second component is over the layer. In an embodiment, the second component comprises a hole that passes through at least a partial thickness of the second component.