Dummy Substrate Cleaning for Semiconductor Wafer Support Surfaces
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Solution Overview
Problem
Current substrate processing apparatuses face challenges in effectively performing cleaning processes, particularly in removing substances like by-products that form between the substrate and the processing surface during semiconductor manufacturing.
Innovation Solution
The apparatus includes a process chamber, a process gas supplier, a cleaning gas supplier, and a substrate support that allows for the use of a dummy substrate with a smaller diameter than the product substrate, enabling effective cleaning by supplying cleaning gas to the outer circumference of the dummy substrate while it is supported on the substrate placing surface, thereby targeting and removing the cleaning target formed by process gas entry between the substrate and the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a full-sized product substrate is used for cleaning, then the cleaning coverage is complete, but the cleaning gas flow and effectiveness are reduced due to gas consumption during actual processing
Solution Approach 1:
The patent employs a dummy substrate that is smaller than the actual product substrate and is used exclusively for cleaning purposes. This dummy substrate can be discarded or replaced without affecting the actual production substrates, providing a dedicated cleaning surface that consumes cleaning gas more efficiently by eliminating the gas consumption that would occur if a full-sized substrate were used for cleaning.
Solution Approach 2:
The dummy substrate serves as a simplified copy or representation of the actual substrate, designed specifically for cleaning operations. It replicates the essential function of providing a substrate surface for cleaning gas interaction without requiring the full size or complexity of the actual product substrate, thereby optimizing cleaning gas flow and effectiveness.
2Device complexity
If cleaning is performed without a dummy substrate, then the apparatus structure is simpler, but the cleaning process is ineffective due to gas consumption and substrate interference
Solution Approach 1:
The dummy substrate is introduced as a simple, dedicated component that can be easily replaced. Its primary function is to provide a consistent substrate surface for cleaning operations, ensuring reliable cleaning effectiveness without adding complex mechanisms to the apparatus.
Solution Approach 2:
The dummy substrate is positioned and sized specifically to create optimal gas flow conditions in the critical cleaning zone. By having a smaller diameter than the product substrate, it allows cleaning gas to effectively reach and clean the chamber walls and surfaces that would otherwise be shadowed or inaccessible during normal processing.
3Reliability
If the substrate placing surface is cleaned thoroughly, then foreign matter is removed, but the time required for cleaning increases
Solution Approach 1:
The dummy substrate consolidates the cleaning function to a single, dedicated component. By directing cleaning gas specifically at the dummy substrate and the accessible chamber surfaces, the cleaning process achieves thoroughness in critical areas without requiring extended cleaning times for the entire chamber, including areas that are difficult to reach or less critical for contamination.
Solution Approach 2:
The dummy substrate is positioned to preemptively intercept and capture contaminants before they can spread to other chamber surfaces. This preliminary action concentrates the cleaning effort on a specific, accessible area, reducing the overall time required to achieve effective cleaning results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a thorough and effective cleaning process, preventing sticking and foreign matter generation within the chamber, and ensures reliable removal of by-products formed during substrate processing.
Implementation Method 1
a cleaning gas supplier configured to supply cleaning gas into the process chamber; and a controller configured to be capable of controlling the process gas supplier and the cleaning gas supplier to perform: processing the product substrate by supplying the process gas... performing a cleaning process on a cleaning target formed by the process gas that has entered between a back surface of the product substrate and the substrate placing surface
Data Source
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AI summary
There is provided a technique capable of effectively performing a cleaning process. There is provided a technique that includes: a process chamber; a process gas supplier; a cleaning gas supplier; a substrate support including a substrate placing surface for supporting a product substrate or a dummy substrate whose diameter is smaller than that of the product substrate; and a controller capable of control operations for processing the product substrate by supplying the process gas; and performing a cleaning process on a cleaning target formed by the process gas entering between a back surface of the product substrate and the substrate placing surface, wherein the cleaning process is performed by supplying the cleaning gas to at least a portion of the substrate placing surface corresponding to an outer circumference of the dummy substrate in a state where the dummy substrate is supported on the substrate placing surface.