Dynamic Cooling Plate Adjusts Substrate Distance for Thermal Shock Prevention
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Solution Overview
Problem
The existing substrate treating apparatuses face inefficiencies in cooling speed and risk of thermal shock damage due to the natural cooling process of the heating unit, which decreases operation capacity and can cause substrate cracking.
Innovation Solution
A cooling unit with a cooling plate, pin member, decompression hole, decompression path, and controller that adjusts the distance between the substrate and the cooling plate using a decompression member, allowing for controlled cooling at different heights to enhance cooling efficiency and prevent thermal shock.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the distance between the substrate and the cooling plate is reduced to increase cooling speed, then cooling efficiency is improved, but the substrate may crack due to thermal shock
Solution Approach 1:
The cooling plate's position is made dynamically adjustable through a driving mechanism that can change the distance between the cooling plate and substrate during the cooling process. This allows the system to optimize cooling efficiency while preventing thermal shock by maintaining appropriate spacing.
Solution Approach 2:
A driving mechanism acts as an intermediary between the cooling plate and substrate, controlling their relative position. This intermediary system enables precise adjustment of the distance to balance cooling speed and substrate protection.
2Use of energy by stationary object
If natural cooling process is used to lower the temperature of the heating plate, then energy consumption is reduced, but the operation capacity decreases due to long cooling time
Solution Approach 1:
The cooling process is made continuous and efficient by using a cooling plate that can be positioned close to the substrate during cooling operations. The driving mechanism enables rapid positioning and retrieval, allowing the heating plate to be quickly ready for the next heating cycle, thus maintaining continuous productive operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases cooling speed and prevents substrate damage from thermal shock by allowing for precise control of the cooling process, improving operational efficiency and substrate integrity.
Implementation Method 1
the cooling plate cools the substrate at the first distance between the substrate and the seating surface of the cooling plate
Implementation Method 2
a decompression member for decompressing the decompression path; and a controller for controlling the decompression member, wherein the controller controls the decompression member to decompress a space between the substrate and the seating surface of the cooling plate
Data Source
AI summary
The inventive concept provides a cooling unit. In an embodiment, the cooling unit comprises: a cooling plate with a seating surface; a pin member arranged at the cooling plate and supporting a substrate; a decompression hole formed on the seating surface; a decompression path formed within the cooling plate and connected to the decompression hole; a decompression member for decompressing the decompression path; and a controller for controlling the decompression member, wherein the controller controls the decompression member to decompress a space between the substrate and the seating surface of the cooling plate and thereby adjusting a distance between the substrate and the seating surface of the cooling plate.