Photosensitive Material Processing TRIZ Cases
- Resist Composition Polymer Lactone Ring Formation
A resist polymer forms a lactone ring under acid action to reduce solubility in organic solvent developers.
- Quencher Design for Chemically Amplified Negative Resist
A chemically amplified negative resist composition uses a specialized onium salt quencher to manage photoacid behavior during lithography exposure.
- Dual-Cure Copolymer for Low-Temp Color Filter Curing
Photo-thermal curing copolymer prevents flexible substrate deformation while ensuring complete crosslinking below 200°C.
- Photoresist Composition Reducing Film Loss and Shrinkage
A photoresist composition utilizes photoradical-assisted self-polymerization to stabilize the film structure during semiconductor manufacturing.
- Infrared Lithographic Printing Plate Precursor Layering
Segmented recording layers with infrared absorbing agents and polyurethane resins resolve the trade-off between development latitude and chemical resistance.
- Inkjet Head Substrate Etching via Mask Opening Width Control
Reactive ion etching forms ink supply port portions using a mask with varying opening widths.
- Photoresist Shrinkage via Tri-Layer Bonding Material
Tri-layer bonding material shrinks photoresist features by 5-15 nm through controlled acid generation.