Inkjet Head Substrate Etching via Mask Opening Width Control
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Solution Overview
Problem
The existing methods for manufacturing inkjet head substrates face challenges in increasing ink discharge frequency while maintaining substrate strength and adhesion performance, as reducing the distance between the energy generating element and the ink supply port can lead to a decrease in substrate strength and adhesion area due to the need for separate processing steps for through and non-through portions in the ink supply port.
Innovation Solution
A method involving the use of reactive ion etching with a mask having varying opening widths to form both through and non-through portions of the ink supply port in a single operation, taking advantage of the microloading effect to create the desired structures efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the ink supply port is relocated toward the energy generating element to reduce distance, then ink discharge frequency increases, but substrate strength and adhesion performance deteriorate due to reduced adhesion area
Solution Approach 1:
The ink supply port is divided into two distinct portions: a through portion that extends completely through the substrate and a non-through portion that extends only partially. This segmentation allows the port to be positioned closer to the energy generating element while preserving substrate integrity in critical regions, thereby maintaining both high ink discharge frequency and adequate substrate strength
Solution Approach 2:
The ink supply port transitions from a simple two-dimensional hole to a three-dimensional structure with varying depth. The through portion creates a complete pathway for ink flow, while the non-through portion provides localized access closer to the energy generating element without compromising the substrate's structural continuity, effectively adding a depth dimension to solve the positioning conflict
2Manufacturing precision
If separate operations are used to form through and non-through portions of the ink supply port, then manufacturing precision can be maintained, but productivity decreases due to increased processing steps
Solution Approach 1:
The formation of both the through portion and non-through portion of the ink supply port is merged into a single etching operation. By using a mask with a strategically designed opening pattern, both portions are created simultaneously in one processing step, eliminating the need for separate operations and thereby maintaining manufacturing precision while significantly improving productivity
Solution Approach 2:
The mask is designed in advance with an opening that defines both the through and non-through portions of the ink supply port. This preliminary design of the mask structure enables the etching process to create both features in a single operation, avoiding the need for multiple sequential processing steps and streamlining the manufacturing workflow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient formation of inkjet head substrates with improved ink discharge frequency and enhanced substrate strength and adhesion performance by extending the adhesion area without increasing processing steps.
Implementation Method 1
forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in a single operation
Data Source
AI summary
A method of manufacturing an inkjet head substrate is provided. The inkjet head substrate includes an ink supply port having a through portion and a non-through portion, and the non-through portion is disposed at a position closer than the through portion to the energy generating element. The method includes disposing a mask having an opening that has a relatively large opening-width portion and a relatively small opening-width portion. The method also includes forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in one operation.