Dynamic Substrate Rerouting in Multi-Module Processing Systems
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Solution Overview
Problem
In substrate processing for semiconductor and LCD manufacturing, the increased complexity of multi-module systems makes it challenging to maintain throughput when modules become unavailable, leading to potential stagnation and overheating of wafers, resulting in inferior products.
Innovation Solution
A substrate processing apparatus and method that dynamically reroutes substrates to available modules within the multi-module system, using a control unit to adjust transfer schedules and destinations when an unavailable module is detected, ensuring continuous processing without standby periods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple modules are added to improve throughput, then productivity increases, but device complexity increases and space requirements increase
Solution Approach 1:
The patent implements dynamic transfer schedule adjustment that automatically adapts when modules become unavailable. The control unit monitors module status and dynamically reroutes substrates to available modules, transforming the static multi-module system into a dynamic one that can handle failures without reducing throughput.
Solution Approach 2:
The system changes operational parameters by modifying transfer schedules and destination modules based on real-time module availability. When a module becomes unavailable, the control unit alters the transfer parameters to route substrates through alternative modules, maintaining system productivity despite changes in module status.
2Reliability
If retraction modules are added to handle module unavailability, then reliability improves, but device complexity and space requirements increase
Solution Approach 1:
The patent makes existing modules universal by enabling them to handle multiple substrate types and processes. Any available module can receive substrates rerouted from unavailable modules, eliminating the need for dedicated retraction modules and maintaining reliability through existing infrastructure.
Solution Approach 2:
The control unit creates virtual copies of transfer schedules for unavailable modules, routing substrates to available modules that perform identical functions. This virtual routing approach provides redundancy without adding physical retraction modules.
3Reliability
If substrates are rerouted to available modules, then reliability improves, but transfer cycle time may increase
Solution Approach 1:
The control unit performs preliminary checks of module availability before substrate transfer and pre-calculates alternative routes. When a module becomes unavailable, the rerouting decision is made immediately based on pre-established transfer schedules, minimizing the time substrates spend in transit and preventing delays.
Solution Approach 2:
The system maintains continuous substrate flow by immediately rerouting to available modules without idle periods. The control unit ensures that transfer operations continue uninterrupted by dynamically adjusting destinations, preventing substrate stagnation and maintaining steady-state processing.
Data Source
AI summary
Even when a module constituting a multi-module becomes an unavailable module, transfer of substrates can be promptly performed, while restricting generation of inferior products. When a destination module of a multi-module becomes unavailable before a substrate is transferred to the destination module, a destination of the substrate is changed to a module to which a substrate subsequent to the substrate is to be loaded. Upon generation of an unavailable module, before the transfer unit accesses the module on an upstream end of the transfer cycle, the transfer cycle proceeds until a precedent substrate becomes ready to be unloaded from the changed destination module. Alternatively, upon generation of an unavailable module, when the transfer unit is located on an upstream side of the unavailable module in the transfer cycle, the transfer operation of the transfer unit is made standby until a precedent substrate becomes ready to be unloaded in the changed destination module.