ECU Power Semiconductor Mounting With Bracketed Leaf Springs

Solution Overview

Problem

Existing electronic control units require a large number of components and increased assembly time due to the need for screws to attach each spring to the cooling baseplate, which also occupies more space.

Innovation Solution

An electronic control unit design that uses a holding bracket with integral holding pins to attach resilient leaf springs, allowing for reduced parts and assembly time by eliminating the need for screws to attach springs directly to the baseplate, with the leaf springs made from sheet metal and integral biasing arms to effectively bias semiconductors towards the heat dissipating baseplate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If each spring is attached with screws to the cooling baseplate, then the semiconductors can be effectively biased towards the baseplate, but the number of parts increases and assembly time increases

Engineering Contradiction:

Improvethermal contact qualityVSAvoidnumber of parts

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The holding bracket merges multiple functions: it provides structural support, attaches the leaf springs, and eliminates the need for separate screw fasteners. The integral holding pins are formed as one piece with the bracket, combining what would otherwise be separate components into a single integrated structure that reduces part count while maintaining secure spring attachment.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The holding bracket serves multiple purposes: it structures the assembly, provides attachment points for leaf springs via integral holding pins, and replaces the need for separate screw fasteners. This multi-functional design reduces the total number of components required in the assembly.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If each spring is attached with screws to the cooling baseplate, then the semiconductors can be effectively biased towards the baseplate, but assembly time increases

Engineering Contradiction:

Improvethermal contact qualityVSAvoidassembly time

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The holding bracket merges multiple functions: it provides structural support, attaches the leaf springs, and eliminates the need for separate screw fasteners. The integral holding pins are formed as one piece with the bracket, combining what would otherwise be separate components into a single integrated structure that reduces part count while maintaining secure spring attachment.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The holding pins are pre-formed as integral parts of the holding bracket during manufacturing, rather than being added as separate assembly steps. This preliminary integration of fastening features into the main structure eliminates the need for separate screw attachment operations during assembly.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If screws are used to attach springs to the baseplate, then secure attachment is achieved, but more space is occupied

Engineering Contradiction:

Improveattachment securityVSAvoidspace occupation

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The holding bracket merges multiple functions: it provides structural support, attaches the leaf springs, and eliminates the need for separate screw fasteners. The integral holding pins are formed as one piece with the bracket, combining what would otherwise be separate components into a single integrated structure that reduces part count while maintaining secure spring attachment.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the number of parts, saves space, and improves assembly efficiency by using a fewer number of components, while maintaining effective heat dissipation through direct contact between semiconductors and the baseplate, enhancing thermal contact and heat transfer.

Implementation Method 1

resilient biasing means arranged between the holding bracket and the plurality of power semiconductors for biasing the power semiconductors towards the baseplate

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

a baseplate for dissipating heat generated in the electronic control unit

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240172397A1Electronic control unit

Publication Date: 2024.05.23 MAHLE INT GMBH

AI summary

An electronic control unit for an electrical machine of an electrically powered drive system is disclosed. The electronic control unit may include at least one semiconductor board, a baseplate, a holding bracket, and at least one resilient biaser. The at least one semiconductor board may include a plurality of power semiconductors. The baseplate may dissipate heat in the electronic control unit. The holding bracket may be attached to the baseplate. The at least one resilient biaser may be arranged between the holding bracket and the plurality of power semiconductors. The at least one resilient biaser may bias the plurality of power semiconductors towards the baseplate. The holding bracket may include at least one connector attaching the at least one resilient biaser to the holding bracket.