Conversion Constructional Details TRIZ Cases

Integrated inverter mounting, routed cabling shafts, and pre-assembled connectors cut installation effort while keeping battery systems expandable.

Separate airflow passages let the inverter power unit receive direct cold air, improving heat dissipation, reliability, and cabinet compactness.

An integrated filter case and refrigerant flow path uses resin filling to suppress noise, improve heat dissipation, and shrink converter size.

A flat connection board shortens current paths between separated substrate areas to cut stray inductance, voltage spikes, and power loss.

A flat connection board shortens power-module current paths to cut stray inductance, voltage spikes, energy loss, and component damage.

By joining the subassembly to the heat sink during resin transfer molding, this case removes a separate curing step and shortens power module build time.

Overlapping holes filled with resin cut spacer stress in bus bar modules, limiting warpage, cracking, and insulation deterioration.

Separate cooling for power switches and off-board inductors helps power converters handle higher switching frequency with lower heat-related failure risk.

A vertical high-side/low-side module stack places the AC busbar between switches to cut parasitic inductance and improve inverter cooling.

Flat conductor frame routing moves signal contacts out of the casting compound, simplifying half-bridge module assembly while preserving heat and current paths.

A magnetic filter on the wire between the switching element and noise filter suppresses spatial EMI leakage while keeping the converter compact.

A three-leg magnetic core with split secondary windings cuts AC ripple and improves saturation resistance in compact power modules.

Stacking upper and lower arm modules with a side capacitor shortens PN current loops and bus bars, cutting inductance in the power control assembly.

Separate converter and busbar housings with isolated connections cut EMI, lower DC link inductance, and protect against moisture and dirt.

A cooler placed between the semiconductor module and capacitor cuts connection space while improving cooling and lowering inductance.

An insulating support body carries laterally arranged power conversion units, cutting height and assembly steps while maintaining insulation and stability.

Factory-built inverter platforms cut on-site wiring time, while cable tree routing prevents tangling and keeps panel connections organized.

A stacked component layout and laminate bus bars shorten wiring paths, cut metal use, and shrink the power conversion unit.

Overlapping bus bars with opposite current directions shield the circuit board from magnetic and electrostatic noise in inverter modules.

Temperature-based control of voltage steepness and crest value helps power converters protect semiconductor-sealing interface withstand at low temperatures.

Direct coolant impingement on inverter semiconductor contacts shortens the heat path, improves cooling, and supports higher continuous power.

Board-mounted coils and circuits let engineers swap converter sections while preserving or adjusting magnetic coupling for stable power transfer.

Bracket-mounted leaf springs replace screw-fastened spring mounts, cutting ECU parts and assembly time while preserving thermal contact to the baseplate.

Separating the magnetic element from boxed electronics and the heat radiator clears airflow and improves inverter heat dissipation.

A stacked conductor layout links multiple chip electrodes to shorten current paths, cutting parasitic inductance and resistance for faster power switching.

A multi-directional bus bar layout preserves insulation distance during insert molding, reducing short-circuit risk in compact current sensors.

A symmetric half-bridge layout places switch elements and diodes for shorter commutation paths, reducing stray inductance and improving switching.