Flat Connection Board Layout for Low-Inductance Power Modules
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Solution Overview
Problem
Power apparatuses experience energy loss and component damage due to voltage spikes caused by stray inductance in current paths, affecting operating efficiency and reliability.
Innovation Solution
A power apparatus design featuring a substrate with separated areas and a connection board that electrically connects power components, reducing current path length and stray inductance by using a flat-shaped connection board instead of wire bonding, which provides mechanical strength and minimizes electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect metallization areas, then electrical connection is achieved, but current path length increases causing increased stray inductance and voltage spikes
Solution Approach 1:
The patent transitions from three-dimensional wire bonding to a two-dimensional flat connection board structure. The connection board lies planarly between metallization areas, reducing the current path from a suspended wire arc to a flat surface path, thereby minimizing stray inductance and voltage spikes.
Solution Approach 2:
The connection board serves as an intermediary component between separate metallization areas. Instead of direct wire bonding between distant areas, the connection board provides an intermediate conductive path that shortens the effective current path length and reduces electromagnetic interference.
2Loss of energy
If connection board is used instead of wire bonding, then current path length is reduced and stray inductance decreases, but device structure becomes more complex
Solution Approach 1:
The connection board integrates multiple functions into a single component: it provides electrical connection, serves as a structural support element, and acts as a shield against electromagnetic interference. This merging reduces the need for separate components and simplifies the overall device architecture despite the added connection board.
Solution Approach 2:
The connection board is constructed from composite materials that provide both electrical conductivity and mechanical strength. This allows the single component to fulfill multiple roles while maintaining structural integrity and reducing the need for additional supporting elements.
3Strength
If flat-shaped connection board is used, then mechanical strength between metallization areas is improved, but manufacturing process becomes more difficult
Solution Approach 1:
The connection board is designed as a segmented or modular component that can be separately manufactured and then integrated into the device. This segmentation allows for specialized manufacturing processes for the connection board itself while simplifying the overall assembly process, as the connection board can be pre-fabricated with required conductive patterns and mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces voltage spikes, energy loss, and device damage, enhancing operating efficiency and reliability by shortening current paths and improving mechanical strength between metallization areas.
Implementation Method 1
The first transmission layer is electrically connected to the first power component and the second area respectively
Implementation Method 2
According to the principle of electromagnetic induction, unnecessary noise or energy loss (such as the switching loss, and so on) may easily occur when the switches of the power apparatus are switched
Implementation Method 3
Especially at the moment when the transistor turns off and suddenly turns on, it is easy to cause voltage spikes (or voltage glitches, and so on) due to the stray inductance generated by the long current path
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A power apparatus (1, 2) includes a substrate (10, 10'), a first power component (20), a second power component (30), and a connection board (40, 40'). The substrate (10, 10') includes a first area (11) and a second area (12) separated from each other. The first power component (20) is arranged on the first area (11). The second power component (30) is arranged on the second area (12). The connection board (40, 40') is arranged between the first area (11) and the second area (12), and is electrically connected to the first power component (20) and the second area (12) respectively.