Stacked Power Converter Layout for Cooling and Low Inductance

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Solution Overview

Problem

Traditional power converters require a large space due to unnecessary spaces around connecting members and protrusions, which hinder efficient housing and cooling of semiconductor modules and capacitors.

Innovation Solution

A power converter design where a semiconductor module, capacitor, and cooler are stacked with the cooler positioned between them, and a connecting member that electrically connects the terminals, minimizing unnecessary space and allowing efficient cooling through grooves or holes filled with insulation, reducing inductance by overlapping positive and negative connecting members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional power converter layout is used with separate connecting members, then electrical connection is achieved, but unnecessary spaces are formed around connecting members and terminals increasing overall device volume

Engineering Contradiction:
Improvepower converter volumeVSAvoidlayout complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The cooler is designed to simultaneously perform cooling and electrical connection functions. The input terminal of the semiconductor module and the capacitor terminal are disposed to face each other with the cooler between them, and the cooler serves as the connecting member to electrically connect these terminals, eliminating the need for separate connecting members and reducing unnecessary spaces.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cooler is given dual functionality: it cools the semiconductor element through thermal conduction while also serving as an electrical connecting member between the input terminal and capacitor terminal. This multi-functionality reduces the number of separate components needed and minimizes the overall device volume.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of moving object

If connecting members are arranged to minimize space, then compact design is achieved, but cooling efficiency may be compromised

Engineering Contradiction:
Improvepower converter volumeVSAvoidcooling efficiency
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The cooler is designed with different regions having different properties: regions in contact with the semiconductor element and capacitor provide thermal conduction for cooling, while the same cooler structure provides electrical conduction for connecting terminals. This local differentiation of functional properties allows the cooler to simultaneously achieve compact electrical connections and effective cooling.

Inventive Principle:
Principle #3Local quality

3Loss of energy

If semiconductor module and capacitor are placed close together, then inductance is reduced, but cooling of semiconductor element becomes more difficult

Engineering Contradiction:
Improveinductance lossVSAvoidsemiconductor element temperature
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The cooler serves as an intermediary component between the semiconductor module and capacitor. It provides a thermal pathway for cooling the semiconductor element while simultaneously providing an electrical pathway to connect the input terminal to the capacitor terminal, thereby reducing inductance. The cooler mediates both thermal and electrical interactions between the closely placed components.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration results in a compact power converter with enhanced cooling efficiency and reduced inductance, suitable for housing in limited spaces such as electric vehicle compartments.

Implementation Method 1

a cooler that is configured to cool the plurality of semiconductor modules and the electric devices

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A connecting member electrically connects the input terminal and the capacitor terminal

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12004333B2Power converter
Publication Date: 2024.06.04 DENSO CORP
  • US12004333B2 patent drawing
  • US12004333B2 patent drawing
  • US12004333B2 patent drawing

AI summary

A power converter includes: a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed; a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface; a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal.