Half-Bridge Power Module Layout for Compact Signal Routing
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Solution Overview
Problem
Existing power modules for electric and hybrid vehicles are difficult to manufacture due to the complexity of integrating signal and power connections made from different materials, leading to increased size and reduced compactness.
Innovation Solution
A half-bridge power module design where semiconductor switch elements, power connections, and signal connections are all located on a substrate's first surface, with power and signal connections formed by a flat conductor frame and cast in a compound, allowing external connection contacts to extend orthogonally, enabling compact and economical production without compromising heat dissipation or current distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal connections and power connections are made from different materials to satisfy signal transfer requirements, then signal transfer quality is improved, but manufacturing complexity increases
Solution Approach 1:
The connection system is segmented into two distinct parts: a flat conductor frame made of electrically conductive material for power connections, and separate signal connections made of electrically non-conductive material with conductive traces. This segmentation allows each material to be optimized for its specific function while simplifying the manufacturing process by enabling production of the frame and signal connections separately before assembly.
Solution Approach 2:
The flat conductor frame acts as an intermediary component that mechanically supports and electrically connects the signal connections to the substrate. The frame provides a stable platform that facilitates the integration of different materials (conductive and non-conductive) while maintaining electrical connectivity and simplifying the overall manufacturing process.
2Ease of manufacture
If the conductor frame is made larger to accommodate bent signal connections, then manufacturing is simplified, but module compactness is reduced
Solution Approach 1:
The signal connections transition from a two-dimensional planar configuration in the flat conductor frame to a three-dimensional structure by extending perpendicularly from the frame. This dimensional change allows the signal connections to be routed vertically through the casting compound to reach the substrate, eliminating the need for a larger conductor frame area while maintaining manufacturing simplicity.
3Ease of manufacture
If all connections are accessed from the same side of the substrate, then assembly is simplified, but heat dissipation efficiency is reduced
Solution Approach 1:
Instead of having all connections exit from the same side (top surface) of the substrate, the invention inverts the connection routing by having power connections and signal connections exit from opposite sides of the substrate. The flat conductor frame with signal connections is positioned on one side while power connections are routed from the other side, allowing heat sinks to be effectively positioned for optimal thermal management while maintaining assembly simplicity.
Data Source
AI summary
A half-bridge includes a substrate, semiconductor switches, power connections and signal connections. The power and signal connections are formed in a flat conductor frame. The signal connections are electrically connected to the semiconductor switches such that they can be switched via the signal connections and the power connections are electrically connected to the semiconductor switches such that they allow or interrupt electricity transfer between the power connections. The semiconductor switches, signal connections, and power connections are on a first surface of the substrate in a casting compound. First end sections of the signal connections formed in the flat conductor frame each extend from a second surface orthogonal to the first surface, exiting the casting compound. Second end sections of the signal connections, which are separate from the flat conductor frame, are connected to the first end section outside the casting compound and are perpendicular to the first surface.